UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

Park, Young-Jun; Lim, Dong-Hyuk; Kim, Hyun‐Joong; Park, Dae-Soon; Sung, Ick-Kyung

doi:10.1016/j.ijadhadh.2009.02.001

Cited by 187 publications

(71 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…After UV-curing, the peaks at 1636 and 809 cm -1 attributed to C=C bonds disappeared or decreased (for CF formulation in Figure 2b). It means that C=C bonds in the reactive monomers took part was the cross-linking reaction by photopolymerization 27,28 . Adding AgNPs into the formulations, no difference was observed on the FTIR spectrum apart from a decreasing of peak intensity (Figure 2c).…”

Section: Ft-ir Characteristicsmentioning

confidence: 99%

Fabrication and Characterization of Antibacterial Polyurethane Acrylate-based Materials

Zeytuncu

Morcali

2015

Mat. Res.

View full text Add to dashboard Cite

Section: Ft-ir Characteristicsmentioning

confidence: 99%

Fabrication and Characterization of Antibacterial Polyurethane Acrylate-based Materials

Zeytuncu

Morcali

2015

Mat. Res.

View full text Add to dashboard Cite

“…Photoinitiator, Irgacure 184, was kindly provided by Ciba. An epoxy acrylate oligomer was synthesized as adapted in the literature [17]. Photoresist lift-off layer, LOL-2000, was purchased from MicroChem Corp. (Marlboro, MA).…”

Section: Methodsmentioning

confidence: 99%

A dual-curable transfer layer for adhesion enhancement of a multilayer UV-curable nanoimprint resist system

et al. 2012

View full text Add to dashboard Cite

We invented a dual-curable transfer layer to enhance adhesion of the UV-curable nanoimprint resist to the substrate. Based on this transfer layer, we developed bilayer resist and trilayer resist UV-curable nanoimprint lithography processes, which were used for etching and lift-off processes, respectively. The dual-curable transfer layer combined at least two different types of reactive functions based on different polymerization mechanisms. It formed strong chemical bonds with both the underneath material and the nanoimprint resist layer in two curing steps. It helped improve the adhesion of the low surface energy resist film to the substrate substantially, and, more importantly, made high-resolution patterning much more reliable. Moreover, low aspect ratio imprinted patterns were amplified into high aspect ratio patterns through the transfer layer via a selective etching process.

show abstract

“…For these reasons, the other curing mechanisms, such as dual curing technology, typically UV/thermal [12], UV/moisture [13] or only thermal curing [14] system have been developed. The thermal cationic curing process of epoxy resin is one of the most suitable industrial technologies.…”

Section: Introductionmentioning

confidence: 99%

Hybrid cationic ring-opening polymerization of epoxy resin/glycidyloxypropyl-polyhedral oligomeric silsesquioxane nanocomposites and dynamic mechanical properties

Hou

Han

et al. 2015

Iran Polym J

View full text Add to dashboard Cite

UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

Cited by 187 publications

References 34 publications

Fabrication and Characterization of Antibacterial Polyurethane Acrylate-based Materials

Fabrication and Characterization of Antibacterial Polyurethane Acrylate-based Materials

A dual-curable transfer layer for adhesion enhancement of a multilayer UV-curable nanoimprint resist system

Hybrid cationic ring-opening polymerization of epoxy resin/glycidyloxypropyl-polyhedral oligomeric silsesquioxane nanocomposites and dynamic mechanical properties

Contact Info

Product

Resources

About