Utilization of Zn alloy for the manufacture of automotive power device modules

Kao, Kuo‐Shu; Chung, Seungjun; Fan, Chia-Wen; Chang, Jung‐Wei; Chang, Tao-Chih

doi:10.1109/icep-iaac.2015.7111074

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) 2015

DOI: 10.1109/icep-iaac.2015.7111074

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Utilization of Zn alloy for the manufacture of automotive power device modules

Kuo‐Shu Kao

Seungjun Chung

Chia-Wen Fan

et al.

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2017

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Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation

Jung¹,

Roh²,

Lee³

et al. 2017

Journal of the Microelectronics and Packaging Society

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Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

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Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation

Jung¹,

Roh²,

Lee³

et al. 2017

Journal of the Microelectronics and Packaging Society

View full text Add to dashboard Cite

show abstract

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Utilization of Zn alloy for the manufacture of automotive power device modules

Cited by 1 publication

References 11 publications

Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation

Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation

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