This paper provides a comprehensive review of the present trends in graphene research with an emphasis on graphene-based nanocomposites and their applications. Various synthesis routes have recently been devised for mass production of graphene to address the needs of the composite industry. This paper describes the worldwide scenario of research and patents being conducted in the field of graphene nanocomposites. It concludes with a discussion of the impact of graphene in composites and the future challenges to meeting industrial demands.

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Ceramic to metal joining has its potential applications in microelectronics packaging, metal-ceramic seals, vacuum tubes, sapphire metal windows, etc. But there are many limitations in joining this duo of materials that range from their structures, nature of bonding, physical properties to a complex phenomenon like wetting, spreading and adhesion. The current review discusses these critical issues from the aspects of thermodynamics, the role, and type of active elements, Ag-Cu-Ti brazing filler system and the reliability factors like residual stress, coefficient of thermal expansion, material reliability, pores and unbonded regions on the surface which affect the mechanical reliability of the joint.

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In this study, the authors have reviewed recent advances on the transient liquid phase (TLP) bonding technology for various applications especially power module packaging in view of the recent increasing demand for the production of vehicles, smartphones, semiconductor devices etc. TLP bonding is one of the potential technologies from clean technology that can replace the Pb-base solder technology without causing any serious environmental issues. It is based on the concept of both brazing as well as diffusion bonding. During TLP bonding, the liquid phase is transiently formed at the bonding interface. At this point, the melting point of filler metal increases due to the diffusion of element which degrades the melting point from liquid phase to base metal. Subsequently, the bonding occurs by isothermal solidification at the bonding temperature of liquid phase. Here, after bonding, the melting temperature of the joint layer becomes higher than bonding temperature. This review introduces the various aspects of TLP bonding including its principle, materials, applications, advantages and properties in detail.