Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation

Abstract

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

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“…Figure 11a-c shows Ag micro powder having a submicron sized chestnut-burr-like shape. In this shape, the powder particles have a higher surface/volume ratio than the spherical powder, the bonding mechanism is almost similar to the Ag NPs during sintering [105,106].…”

“…shape. In this shape, the powder particles have a higher surface/volume ratio than the spherical powder, the bonding mechanism is almost similar to the Ag NPs during sintering [105,106]. If the pressure is applied during sintering, the bonding layer of powders can have a denser structure.…”