Using High Speed Camera for Electronic Board Failure Analysis

Abstract

Historically, the most common failure analyses metrologies have been dye-and-pull, cross-sections, microscopy, optical and SEM. Using these traditional metrologies to find a root cause from a dynamic event can be very time consuming and sometimes inconclusive. The standard methodology is to work backward to reconstruct the “event” that caused or initiated failure. Often times the root cause is not immediately obvious and design improvements require an iterative process to identify the true root cause. This approach is costly in time, materials and resources. A high speed camera (HSC) allows identification of failure from a point of initiation. Using the point of initiation concept with reconstructive modeling allows a design team to discover potential initiating sources and better match a cause to the effect and implement corrective action. This decreases development time, minimizing product design cycle and increases market opportunities.

Mechanical Modeling and Analysis of Board Level Drop Test of Electronic Package

“…The deflection is measured using a high-speed camera system and motion capture software [7]. The comparison shows good matching in terms of maximum deflection and frequency of the vibration, as shown in Fig.…”