Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection

Lohan, John; Tiilikka, P.; Rodgers, Peter; Fager, C.-M.; Rantala, Jukka

doi:10.1109/itherm.2000.866194

Cited by 12 publications

(3 citation statements)

References 17 publications

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“…At package level, the numerical results are compared with the standard JEDEC (Wang et al , 2000; Lohan et al , 2000). The steady-state and dynamic thermal measurements, according with JEDEC-JESD51 guideline requirements, were done by Analysis-Tech Company on six samples of the BGA208 mounted on three 2s0p and three 2s2p test vehicles.…”

Section: Jedec Experimental Resultsmentioning

confidence: 99%

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Monier-Vinard

Rogié

Bissuel

et al. 2017

HFF

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Purpose Latest Computational Fluid Dynamics (CFDs) tools allow modeling more finely the conjugate thermo-fluidic behavior of a single electronic component mounted on a Printed Wiring Board (PWB). A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. The purpose of this study is to confront the predictions of the fully detailed numerical model of an electronic board to a set of experiment results to assess their relevance. Design/methodology/approach The present study focuses on the case of a Ball Grid Array (BGA) package of 208 solder balls that connect the component electronic chip to the Printed Wiring Board. Its complete geometrical definition has to be coupled with a realistic board layers layout and a fine description of their numerous copper traces to appropriately predict the way the heat is spread throughout that multi-layer composite structure. The numerical model computations were conducted on four CFD software then compare to experiment results. The component thermal metrics for single-chip packages are based on the standard promoted by the Joint Electron Device Engineering Council (JEDEC), named JESD-51. The agreement of the numerical predictions and measurements has been done for free and forced convection. Findings The present work shows that the numerical model error is lower than 2 per cent for various convective boundary conditions. Moreover, the establishment of realistic numerical models of electronic components permits to properly apprehend multi-physics design issues, such as joule heating effect in copper traces. Moreover, the practical modeling assumptions, such as effective thermal conductivity calculation, used since decades, for characterizing the thermal performances of an electronic component were tested and appeared to be tricky. A new approach based on an effective thermal conductivity matrix is investigated to reduce computation time. The obtained numerical results highlight a good agreement with experimental data. Research limitations/implications The study highlights that the board three-dimensional modeling is mandatory to properly match the set of experiment results. The conventional approach based on a single homogenous layer using effective thermal conductivity calculation has to be banned. Practical implications The thermal design of complex electronic components is henceforth under increasing control. For instance, the impact of gold wire-bonds can now be investigated. The three-dimensional geometry of sophisticated packages, such as in BGA family, can be imported with all its internal details as well as those of its associated test board to build a realistic numerical model. The establishment of behavioral models such as DELPHI Compact Thermal Models can be performed on a consistent three-dimensional representation with the aim to minimize computation time. Originality/value The study highlights that multi-layer copper trace plane discretization could be used to strongly reduce computation time while conserving a high accuracy level.

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Section: Jedec Experimental Resultsmentioning

confidence: 99%

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Monier-Vinard

Rogié

Bissuel

et al. 2017

HFF

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“…This is exactly what has been investigated by Lohan et al 8 and Davies et al 9 Instead of a multi-parameter approach such as is advocated in this book, another approach has been chosen: to adjust the junction-to-reference thermal resistances as provided by the manufacturers to take account of operational conditions. They investigated the effects of PCB construction, including presence of copper tracking, multiple layers and their location, and component position on the standard thermal parameters R JA , Ψ JB and Ψ JC , both for natural and forced convection.…”

Section: History Of Search For Alternativesmentioning

confidence: 99%

Historical Overview of Proposals for Enhanced Thermal Metrics

Lasance

Sabry

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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“…A lot of research has been conducted regarding general issues as traces current abilities, calculation of the losses, high frequency ability and noise on the PCB boards etc. [5,6,7,8]. The design procedure is given in [9,10,11] and design standards [12] is describes in detail in [3,13].…”

Section: Introductionmentioning

confidence: 99%

Determining PCB Trace Capability and Fusing, Used in Switch Mode Power Supplies, Based on Modeling and Simulation With the Finite Element Method

Dimitrov¹,

Environment²,

Cruden³

et al. 2018

AEI

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Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection

Cited by 12 publications

References 17 publications

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Historical Overview of Proposals for Enhanced Thermal Metrics

Determining PCB Trace Capability and Fusing, Used in Switch Mode Power Supplies, Based on Modeling and Simulation With the Finite Element Method

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