Untersuchungen zur Plasmaäzung von Polymeren. Teil III. Plasmamodifizierung von Polymeroberflächen zur Verbesserung der Hafteigenschaften der Polymere

Abstract

die Oberflachenmodifizierung als auch die Vernickelung uber Nickeltetracarbonyl im Plasma fuhrten jeweils zu ausgezeichneten Haftfestigkeitswerten zwischen Polymer und Kupferdeckschichten. Oberflachenaufrauhung, chemische und strukturelle Anderungen des Polymergefuges an der Oberflache und die Schaffung atzgasspezifischer funktioneller Oberflachengruppen werden als Ursache der Verbessernng der Hafteigenschaften angesehen. Ilccaeaoeanm R naaamennofiy mpaeaenum noauaepos. rIacmb I I I . ilioau@uuyupoeanue e naame noeepxnocmu noauaepoe c yeaam yayrtuenua ux aazeauu

Significance of Hydrogen–Deuterium Exchange at Polyolefin Surfaces on Exposure to Ammonia Low-Pressure Plasma

“…It is to note that the yield in primary amino group formation in plasmas of ammonia, nitrogen or nitrogen-hydrogen mixtures is lower than 10% of all inserted nitrogen components [7,8]. Therefore, this amination reaction is only a side-reaction.…”

“…For this purpose polyolefin surfaces were exposed to plasmas of ammonia, nitrogen or N 2 /H 2 and its deuterated species. Deuteration of substrate, precursors or plasma gas is a comfortable way to find out reaction mechanism as shown for the comparison of plasma polymers made from deuterated and non-deuterated monomers [43]. The simultaneous deuteration and N-introduction to polyolefin surfaces by use of ND 3 plasma was shown in preliminary experiments in 1980s [44,45].…”

“…Ammonia plasma treatment was also applied to aromatic polyamide (Kevlar) fibres for linking with epoxy-resin in composite materials [4]. In former times, PET foils were exposed to the ammonia plasma for improving the adhesion between PET and copper by complex formation applied to metallization steps in magnetic tape technology [5,6].…”

Plasma-printing and galvanic metallization hand in hand—A new technology for the cost-efficient manufacture of flexible printed circuits

“…for polyimide, polycarbonate, polyethylene, poly(ethylene terephthalate) and polystyrene and even for chemically very resistant polymers such as polytetrafluoroethylene [1][2][3][4][5]. Among the process gases used were air, oxygen, ammonia and nitrogen.…”

Non-thermal plasma assisted lithography for biomedical applications: an overview

“…In a series of first-order processes, these fragments will rearrange, reactivate and fragment again, resulting in low deposition rates. The deposited thin film will therefore have a monomer composition and structure that is barely recognisable [57,58,63,64]. In terms of biomedical applications, the atomic deposition regime is of less interest.…”