Plasma-printing and galvanic metallization hand in hand—A new technology for the cost-efficient manufacture of flexible printed circuits

Möbius, A.; Elbick, Danica; Weidlich, E.; Feldmann, Klaus; Schüßler, Florian; Borris, Jochen; Thomas, Michael; Zänker, Antje; Klages, Claus‐Peter

doi:10.1016/j.electacta.2008.08.050

Cited by 20 publications

(12 citation statements)

References 13 publications

(12 reference statements)

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“…Compared to plasma-based modification techniques, the wet-chemical methods do not require expensive vacuum equipment and are easy to integrate in a production line. However, it must be mentioned that straightforward local plasma treatments to generate patterned electroless copper on flexible films have been demonstrated recently [9].…”

Section: Introductionmentioning

confidence: 99%

Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper

Schaubroeck

Mader

Dubruel

et al. 2015

Applied Surface Science

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Section: Introductionmentioning

confidence: 99%

Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper

Schaubroeck

Mader

Dubruel

et al. 2015

Applied Surface Science

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“…Printing these devices has, however, required the development of many novel techniques among the various fields of production processes [26,27]. As opposed to the subtractive fabrication processes commonly employed in the production of circuits, such as etching, basic electronic components can be fabricated using processes such as screen, gravure, inkjet, and aerosol jet printing among many others [26][27][28][29].…”

Section: Review Of Printed Electronicsmentioning

confidence: 99%

“…As opposed to the subtractive fabrication processes commonly employed in the production of circuits, such as etching, basic electronic components can be fabricated using processes such as screen, gravure, inkjet, and aerosol jet printing among many others [26][27][28][29]. The significance of these techniques is their ability to create circuits directly upon a target substrate.…”

Section: Review Of Printed Electronicsmentioning

confidence: 99%

“…There are concerns which need be addressed, as the plethora of materials and combinations presented by additive manufacturing techniques create numerous possible combinations in design [1,3,27,48,50]. Forgoing variability of the mechanical properties associated with the printing process, more accurate and precise construction algorithms along with advanced modeling techniques are the major concern with the printing process.…”

Section: All-printed Smart Structuresmentioning

confidence: 99%

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All-printed smart structures: a viable option?

et al. 2014

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The last two decades have seen evolution of smart materials and structures technologies from theoretical concepts to physical realization in many engineering fields. These include smart sensors and actuators, active damping and vibration control, biomimetics, and structural health monitoring. Recently, additive manufacturing technologies such as 3D printing and printed electronics have received attention as methods to produce 3D objects or electronic components for prototyping or distributed manufacturing purposes. In this paper, the viability of manufacturing all-printed smart structures, with embedded sensors and actuators, will be investigated. To this end, the current 3D printing and printed electronics technologies will be reviewed first. Then, the plausibility of combining these two different additive manufacturing technologies to create all-printed smart structures will be discussed. Potential applications for this type of all-printed smart structures include most of the traditional smart structures where sensors and actuators are embedded or bonded to the structures to measure structural response and cause desired static and dynamic changes in the structure.

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“…Current methods for surface patterning, including those utilizing low-pressure plasmas [13][14][15] and chemical vapor deposition [16], usually require the use of physical masks [17,18]. Alternatively, microplasmas can be used for localized surface modification using a method known as "plasma printing" [19][20][21][22][23][24][25]. Here, spatially resolved modification of surface chemistry is achieved through the contact between the substrate and the plasma stamp.…”

Section: Introductionmentioning

confidence: 99%

Microplasma Array Patterning of Reactive Oxygen and Nitrogen Species onto Polystyrene

Szili

Dedrick

et al. 2017

Front. Phys.

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We investigate an approach for the patterning of reactive oxygen and nitrogen species (RONS) onto polystyrene using atmospheric-pressure microplasma arrays. The spectrally integrated and time-resolved optical emission from the array is characterized with respect to the applied voltage, applied-voltage frequency and pressure; and the array is used to achieve spatially resolved modification of polystyrene at three pressures: 500, 760, and 1000 Torr. As determined by time-of-flight secondary ion mass spectrometry (ToF-SIMS), regions over which surface modification occurs are clearly restricted to areas that are exposed to individual microplasma cavities. Analysis of the negative-ion ToF-SIMS mass spectra from the center of the modified microspots shows that the level of oxidation is dependent on the operating pressure, and closely correlated with the spatial distribution of the optical emission. The functional groups that are generated by the microplasma array on the polystyrene surface are shown to readily participate in an oxidative reaction in phosphate buffered saline solution (pH 7.4). Patterns of oxidized and chemically reactive functionalities could potentially be applied to the future development of biomaterial surfaces, where spatial control over biomolecule or cell function is needed.

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Plasma-printing and galvanic metallization hand in hand—A new technology for the cost-efficient manufacture of flexible printed circuits

Cited by 20 publications

References 13 publications

Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper

Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper

All-printed smart structures: a viable option?

Microplasma Array Patterning of Reactive Oxygen and Nitrogen Species onto Polystyrene

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