1996
DOI: 10.1007/bf02655040
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Uniform low defect density molecular beam epitaxial HgCdTe

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Cited by 47 publications
(20 citation statements)
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“…Further details can be found in our earlier publications. [3][4][5][6][7][8] Indium was used as the dopant for n-type layers. The p-type layers doped with As were grown using both a conventional As 4 source and a cracker cell with the cracker element operating at 700°C to produce As 2 molecules from evaporated As 4 .…”
Section: Methodsmentioning
confidence: 99%
“…Further details can be found in our earlier publications. [3][4][5][6][7][8] Indium was used as the dopant for n-type layers. The p-type layers doped with As were grown using both a conventional As 4 source and a cracker cell with the cracker element operating at 700°C to produce As 2 molecules from evaporated As 4 .…”
Section: Methodsmentioning
confidence: 99%
“…9 This consists of a HgCdTe absorber layer doped n-type with indium and a wider bandgap cap layer. The formation of the p-on-n junction-diode is achieved by selective area ionimplantation of arsenic through a photoresist window followed by high temperature annealing for cap layer diffusion and carrier activation.…”
Section: Methodsmentioning
confidence: 99%
“…7,8 The device is composed of a narrow-bandgap n-type absorber layer (AL) and a wide-bandgap n-type cap layer (CL) in a planar configuration. The layers are grown by MBE on CdZnTe substrates with an intermediate wide-bandgap buffer layer (BL).…”
Section: Device Geometry: Double Layer Pla-nar Hetero-structurementioning
confidence: 99%