2004
DOI: 10.1007/s11664-004-0077-y
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Molecular beam epitaxy growth of high-quality arsenic-doped HgCdTe

Abstract: We have initiated a joint effort to better elucidate the fundamental mechanisms underlying As-doping in molecular beam epitaxy (MBE)-grown HgCdTe. We have greatly increased the As incorporation rate by using an As cracker cell. With a cracker temperature of 700°C, As incorporation as high as 4 ϫ 10 20 cm Ϫ3 has been achieved by using an As-reservoir temperature of only 175°C. This allows the growth of highly doped layers with high quality as measured by low dislocation density. Annealing experiments show highe… Show more

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Cited by 27 publications
(17 citation statements)
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References 14 publications
(12 reference statements)
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“…Summarising the data obtained, we can observe that they are consistent with the tendency established earlier [6][7][8]. The efficiency of incorporation of electrically active arsenic into MBE MCT films increases at T cr >600 °C.…”
Section: Figuresupporting
confidence: 91%
“…Summarising the data obtained, we can observe that they are consistent with the tendency established earlier [6][7][8]. The efficiency of incorporation of electrically active arsenic into MBE MCT films increases at T cr >600 °C.…”
Section: Figuresupporting
confidence: 91%
“…The use of a cracker cell enabled comparison between As 4 and As 2 . 1 Although more arsenic was incorporated with As 2 , much of it could not be activated at concentrations above 10 18 atoms cm -3 even after the high-temperature anneal. Up to $10 18 cm -3 , 100% activation of the arsenic can be achieved by an anneal at 400°C to 500°C followed by a vacancy-filling anneal at 250°C, both under Hg saturated conditions.…”
Section: Literature Review Of Arsenic Doping In Mctmentioning
confidence: 99%
“…1. Group I doping by substitution on the group II sites has not been widely considered because these are fast diffusers and hence not suitable for abrupt junction control.…”
Section: Introductionmentioning
confidence: 99%
“…1 In Table I the best reported values of X-ray diffraction (XRD) full-width at half-maximum (FWHM) and etch pit density (EPD) from molecular-beam epitaxy (MBE) (211)B HgCdTe/CdZnTe, HgCdTe/CdTe/Si, CdZnTe, and CdTe/Si have been compiled. [2][3][4][5][6][7][8][9][10][11] As-grown MBE (211)B CdTe/Si has a larger defect density and more disordered crystallinity than bulk (211)B CdZnTe substrates. This results in MBE (211)B HgCdTe/CdTe/Si having a larger defect density and more disordered crystallinity than MBE (211)B HgCdTe/CdZnTe.…”
Section: Introductionmentioning
confidence: 99%