Uncooled infrared sensor performance

Marasco, Peter L.; Dereniak, Eustace L.

doi:10.1117/12.160557

Cited by 17 publications

(13 citation statements)

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“…Eqs. (1)- (9) are valid for the assumption that the bolometer temperature and the surrounding (background) temperature are equal [4]. The NETD model only takes into account the radiation flux in the k1 to k2 wavelength interval and neglects effects from stray and off-axis infrared radiation.…”

Section: Calculational Model For the Noise Equivalent Temperature Difmentioning

confidence: 99%

“…(1)-(9) of the NETD model are derived from Eqs. (11)- (20), which are commonly used equations [4][5][6][7][8] modified to take the influence of the ROIC input impedance into account…”

Section: Calculational Model For the Noise Equivalent Temperature Difmentioning

confidence: 99%

“…Authors have calculated the fundamental performance limits of uncooled infrared bolometer arrays with their NETD limited by the background radiation noise [4,5,8]. One group has published an analysis of the detailed noise contributions to the total NETD of uncooled vanadium oxide bolometer arrays [10].…”

Section: Introductionmentioning

confidence: 99%

“…Various authors have developed figures of merit describing infrared bolometer and system performances such as responsivity ðRÞ, noise equivalent power (NEP), detectivity (D * ), and noise equivalent temperature difference (NETD) [4][5][6][7][8]. The responsivity ðRÞ is defined as the output signal voltage or output signal current of an infrared bolometer pixel per incident radiant power on the pixel.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure

Niklaus¹,

Decharat²,

Jansson³

et al. 2008

Infrared Physics & Technology

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Section: Calculational Model For the Noise Equivalent Temperature Difmentioning

confidence: 99%

“…(1)-(9) of the NETD model are derived from Eqs. (11)- (20), which are commonly used equations [4][5][6][7][8] modified to take the influence of the ROIC input impedance into account…”

Section: Calculational Model For the Noise Equivalent Temperature Difmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure

Niklaus¹,

Decharat²,

Jansson³

et al. 2008

Infrared Physics & Technology

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“…IR imaging technology can be separated in two main realms; cooled detectors working with direct photon detection in the infrared wavelength, and uncooled thermal IR detectors that are based on heat absorption and the electrical measurement of the resulting temperature change of the detector membrane. Today, the vast majority of commercially available IR imaging systems utilizes uncooled IR bolometer focal plane array technology [5][6][7][8][9][10][11][12][13][14][15][16][17]. Uncooled IR bolometer focal plane arrays consist of matrixes of small suspended bolometer sensor membranes that are placed on top of CMOS-based integrated electronic circuits as depicted in Figure 1a.…”

Section: Introductionmentioning

confidence: 99%

Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers

Malm¹,

Kolahdouz²,

Forsberg

et al. 2012

MRS Proc.

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Semiconductor-based thermistors are very attractive sensor materials for uncooled thermal infrared (IR) bolometers. Very large scale heterogeneous integration of MEMS is an emerging technology that allows the integration of epitaxially grown, high-performance IR bolometer thermistor materials with pre-processed CMOS-based integrated circuits for the sensor read-out. Thermistor materials based on alternating silicon (Si) and silicon-germanium (SiGe) epitaxial layers have been demonstrated and their performance is continuously increasing. Compared to a single layer of silicon or SiGe, the temperature coefficient of resistance (TCR) can be strongly enhanced to about 3 %/K, by using thin alternating layers. In this paper we report on the optimization of alternating Si/SiGe layers by advanced physically based simulations, including quantum mechanical corrections. Our simulation framework provides reliable predictions for a wide range of SiGe layer compositions, including concentration gradients. Finally, our SiGe thermistor layers have been evaluated in terms of low-frequency noise performance, in order to optimize the bolometer detectivity.

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3D Optical microstructure fabrication and its bonding to micro IR detector using elastomeric polymer

Park

Kim

Shin

et al. 2005

Microsystem Technologies

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This paper describes polidimethylsiloxane(PDMS) based bonding for assembly of microstructure device, an UV lithography applications for fabricating a 3-dimensional (3D) feed-horn-shaped structure mold array, and obtaining parallel light by using a mirror-reflected parallel-beam illuminator (MRPBI) system. A 3D feedhorn-shaped micro-electro-mechanical systems (MEMS) antenna has some attractive features for array applications, which can be used to improve microbolometer performance and to enhance the optical efficiency for thin film transistor-liquid crystal display (TFT-LCD) and other display devices but currently, MEMS technology has faced many difficulties in the fabrication of a 3D feed-hornshaped MEMS antenna array itself. The purpose of this paper is to propose a new fabrication method to realize a 3D feed-horn-shaped MEMS antenna array by using a mirror-reflected parallel-beam illuminator (MRPBI) System with a very slowly rotated, inclined x-y-z stage. With a conventional UV lithography apparatus, it is very difficult to fabricate high-aspect-ratio structures (HARS) because a typical UV lithography apparatus cannot produce perfectly parallel light. From a theoretical analysis, a columnar illuminator over 6 m in height is required to achieve parallel light, but generally a laboratory height is not 6 m. Also, a novel method of lithography was tried to make a 3D structure array by exposing a planar wafer to the generated parallel light and rotating an inclined x-y-z stage at an ultra-slow rate. An optimization of the 3D structure array can be achieved by simulating a 3D feed-horn MEMS antenna. The feasibility of fabricating both a 3D feed horn MEMS antenna and assembly of detector with 3D feed-horn MEMS antenna was demonstrated. As a result, it seems possible to use a 3D feed-horn-shaped MEMS antenna to improve microbolometer performance and to fabricate several optical microstructure applications. IntroductionModern advances in the micro-electro-mechanical systems (MEMS) technologies have given rise to the advent of various MEMS fabrication techniques for fabricating microstructures from various materials [1-3]. There is also a need for complicated 3-dimensional microstructures with high aspect ratios for such applications as enhanced microbolometer-coupled 3D MEMS antenna arrays and enhanced optical efficiency and other optical devices [4][5]. Figure 1 shows a schematic drawing of a 3D feed-horn MEMS antenna coupled with a microbolometer. Although the 3D feed-horn MEMS antenna structures have many advantages, it is difficult to fabricate them using conventional UV lithography techniques. In this paper, a novel method for realizing 3D feed-horn MEMS antenna assembled infrared detector. Novel UV-photolithography apparatusThe most difficult problem in the fabrication of high-aspect-ratio structures (HARS) and 3D feed-horn-shaped MEMS antenna arrays is how to achieve a parallel beam when using a UV lithography apparatus. UV light propagation longer than 6 m would be required for a 11.16 cm 2 exposure area. Accord...

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Uncooled infrared sensor performance

Cited by 17 publications

References 0 publications

Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure

Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure

Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers

3D Optical microstructure fabrication and its bonding to micro IR detector using elastomeric polymer

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