Ultrasonic Bonding of Ag and Ag-Alloy Ribbon—An Innovative Alternative for High Power IC Packages

Chen, Chun‐Hao; Lin, Yu-Cheng; Groth, Anne; Lai, Yu-Chang; Lin, Chia-Ying; Chang, Heng-Ming; Chuang, Tung‐Han

doi:10.1109/tcpmt.2020.2988129

Cited by 7 publications

(2 citation statements)

References 21 publications

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“…Recently, ultrasonic ribbon bonding has received more and more attention in power electronic packaging compared with traditional wire bonding. The high current density tolerance and excellent heat dissipation of ultrasonic ribbon bonding, which features the flexibility of wire bonding and wider bonding parameter window, have driven the adoption of it to meet the requirements of high reliability packaging [ 149 , 150 , 151 ]. Based on the successful experience of replacing Au with Ag wires, Ag and Ag alloy ribbons are foreseeable options for high-power ICs.…”

Section: Ag Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Ag Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…Furthermore, a new trend of utilizing ribbon to replace heavy wire has gained much attention due to the lower resistance, large cross-section, and better reliability of ribbon (Chen et al, 2020;Heimann et al, 2012;Jacques et al, 2015), which shows superior performance in comparison to traditional heavy wires in reliability tests and therefore is favored for special packaging structures (Heimann et al, 2012). For ribbon bonding application in high power modules, there have been numerous studies related to Al ribbon, Al-Cu ribbon, and Cu ribbon bonding (Delmonte et al, 2023;Li et al, 2023;Lu et al, 2023;Nwanoro et al, 2018) However, there has been relatively limited exploration in the area of Ag and Ag alloy ribbon bonding; only a few studies have reported the feasibility and process parameters (Chen & Chuang, 2020;Chen & Chuang, 2021;. The difficulty lies in the fact that the bonding process of heavy ribbon on the chip side requires increased ultrasonic energy to soften the ribbon material, presenting a high possibility of chip cratering during bonding.…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization

Chiang,

Lee,

Lin

et al. 2023

International Journal of Manufacturing, Materials, and Mechanical Engineering

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Ultrasonic ribbon bonding has gained much attention due to the endeavor of achieving higher module performance in power electronic packaging. Among all the ribbon materials, Ag ribbon is a promising candidate due to its superior electrical properties. However, research which has reported the bonding of the ribbon on chip side is scant. Thus, in this study, the authors carried out bonding of the Ag ribbon on various types of metallized wafers to examine the feasibility of Ag ribbon, simulating the bonding scenario on the chip side in power modules. Results revealed that bonding of the Ag ribbon is feasible on those wafers metallized Ag on top. The authors also discussed the implications for the bondability of Ag ribbon with different types of metallization layers.

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