Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments

Chen, Chun‐Hao; Lai, Yu-Chang; Chuang, Tung‐Han

doi:10.1016/j.jallcom.2021.158619

Cited by 8 publications

(6 citation statements)

References 57 publications

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“…Recently, ultrasonic ribbon bonding has received more and more attention in power electronic packaging compared with traditional wire bonding. The high current density tolerance and excellent heat dissipation of ultrasonic ribbon bonding, which features the flexibility of wire bonding and wider bonding parameter window, have driven the adoption of it to meet the requirements of high reliability packaging [ 149 , 150 , 151 ]. Based on the successful experience of replacing Au with Ag wires, Ag and Ag alloy ribbons are foreseeable options for high-power ICs.…”

Section: Ag Bonding Wirementioning

confidence: 99%

“…Based on the successful experience of replacing Au with Ag wires, Ag and Ag alloy ribbons are foreseeable options for high-power ICs. Chen et al [ 151 ] studied the microstructure evolution of Ag-4Pd ribbon under different annealing conditions by electron backscatter diffraction (EBSD) technique, and discussed its mechanical properties, which provided a theoretical basis for the application of high-power IC modules. Chen et al [ 152 ] further studied the influence of bonding parameters on the bonding performances of Ag-4Pd ribbon.…”

Section: Ag Bonding Wirementioning

confidence: 99%

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Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Ag Bonding Wirementioning

confidence: 99%

Section: Ag Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…The bonding wire also has a significant advantage, that is, with the extension of aging time, its tensile strength and elongation increase at the same time. Chen et al [50] used EBSD analysis to study the annealing treatment of Ag-4Pd ribbon. Figure 6a-c show the SEM image of the Ag-4Pd ribbon material after annealing for 6 s at 873 K, the reverse pole diagram of crystal orientation (IPF) and the characteristic grain boundaries of the prepared Ag-4Pd ribbon, respectively.…”

Section: Silver Bonding Wire Manufacturing Processmentioning

confidence: 99%

A Review of Silver Wire Bonding Techniques

An,

Zhou,

Cao

et al. 2023

Micromachines

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The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

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“…Grain boundary engineering (GBE) was developed based on the conception of “grain boundary design and control” proposed by Watanabe et al [ 1 ] in order to strengthen the intergranular degradation resistance of materials. Until now, it has been widely used to enhance the grain-boundary-related properties in many face-centered cubic (FCC) materials with low and medium stacking fault energies (SFEs), such as austenitic stainless steels [ 2 , 3 ], Ag-Pd alloys [ 4 ], nickel-based alloys [ 5 , 6 ], and copper alloys [ 7 ]. The enhancement of properties is ascribed to the optimization of the grain boundary character distribution (GBCD), which is achieved by increasing the proportion of special twin boundaries and disrupting the connectivity of the random boundary network [ 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

A Review on Controlling Grain Boundary Character Distribution during Twinning-Related Grain Boundary Engineering of Face-Centered Cubic Materials

et al. 2023

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Grain boundary engineering (GBE) is considered to be an attractive approach to microstructure control, which significantly enhances the grain-boundary-related properties of face-centered cubic (FCC) metals. During the twinning-related GBE, the microstructures are characterized as abundant special twin boundaries that sufficiently disrupt the connectivity of the random boundary network. However, controlling the grain boundary character distribution (GBCD) is an extremely difficult issue, as it strongly depends on diverse processing parameters. This article provides a comprehensive review of controlling GBCD during the twinning-related GBE of FCC materials. To commence, this review elaborates on the theory of twinning-related GBE, the microscopic mechanisms used in the optimization of GBCD, and the optimization objectives of GBCD. Aiming to achieve control over the GBCD, the influence of the initial microstructure, thermo-mechanical processing (TMP) routes, and thermal deformation parameters on the twinning-related microstructures and associated evolution mechanisms are discussed thoroughly. Especially, the development of twinning-related kinetics models for predicting the evolution of twin density is highlighted. Furthermore, this review addresses the applications of twinning-related GBE in enhancing the mechanical properties and corrosion resistance of FCC materials. Finally, future prospects in terms of controlling the GBCD during twinning-related GBE are proposed. This study will contribute to optimizing the GBCD and designing GBE routes for better grain-boundary-related properties in terms of FCC materials.

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Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments

Cited by 8 publications

References 57 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

A Review of Silver Wire Bonding Techniques

A Review on Controlling Grain Boundary Character Distribution during Twinning-Related Grain Boundary Engineering of Face-Centered Cubic Materials

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