BackgroundOur systematic review summarizes the evidence concerning the accuracy of serum diagnostic and prognostic tests for colorectal cancer (CRC).MethodsThe databases MEDLINE and EMBASE were searched iteratively to identify the relevant literature for serum markers of CRC published from 1950 to August 2012. The articles that provided adequate information to meet the requirements of the meta-analysis of diagnostic and prognostic markers were included. A 2-by-2 table of each diagnostic marker and its hazard ratio (HR) and the confidence interval (CI) of each prognostic marker was directly or indirectly extracted from the included papers, and the pooled sensitivity and specificity of the diagnostic marker and the pooled HR and the CI of the prognostic marker were subsequently calculated using the extracted data.ResultsIn total, 104 papers related to the diagnostic markers and 49 papers related to the prognostic serum markers of CRC were collected, and only 19 of 92 diagnostic markers were investigated in more than two studies, whereas 21 out of 44 prognostic markers were included in two or more studies. All of the pooled sensitivities of the diagnostic markers with > = 3 repetitions were less than 50%, and the meta-analyses of the prognostic markers with more than 3 studies were performed, VEGF with highest (2.245, CI: 1.347–3.744) and MMP-7 with lowest (1.099, CI: 1.018–1.187)) pooled HRs are presented.ConclusionsThe quality of studies addressing the diagnostic and prognostic accuracy of the tests was poor, and the results were highly heterogeneous. The poor characteristics indicate that these tests are of little value for clinical practice.

The numerical method on a double-channel sewage pump was studied, while the corresponding experimental result was also provided. On this basis, the influence of wall roughness on the pump performance was deeply studied. The results showed that there was a critical value of wall roughness. When the wall roughness was less than the critical value, it had a great influence on the pump performance, including the head, efficiency, and shaft power. As the wall roughness increased, the head and efficiency were continuously reduced, while the shaft power was continuously increased. Otherwise, the opposite was true. The effect of wall roughness on the head and hydraulic loss power was much smaller than that on the efficiency and disk friction loss power, respectively. With the increase of wall roughness, mechanical efficiency and hydraulic efficiency reduced constantly, leading to the decrement of the total efficiency. With the increase of flow rate, the effect of wall roughness on the head and efficiency gradually increased, while the influence on the leakage continuously reduced. The influence of the flow-through component roughness on the pump performance was interactive.Energies 2020, 13, 464 2 of 20 Literature OverviewIn the past years, many scholars studied the effect of wall roughness on the flow in pipes, fans, compressors, microchannels. In order to study the effect of wall roughness in turbulent pipe flow, Hemeida [17] developed an equation for estimating the thickness of the laminar sublayer in turbulent pipe flow of pseudoplastic fluids and found that the turbulent pipe flow could be divided into two regions: smooth wall and rough wall turbulence. The roughness Reynolds number was used to determine the smooth wall turbulence and rough wall turbulence regions. Kandlikar [18] studied the roughness effects at microscale-reassessing Nikuradse's experiments on liquid flow in rough tubes, and found that Nikuradse's work was revisited in light of the recent experimental work on roughness effects in microscale flow geometries. Li et al. [19] studied the influence of the internal surface roughness of the nozzle on cavitation erosion characteristics of submerged cavitation jets from the aspects of erosion intensity and erosion efficiency; it could be concluded that excessive smooth surface was not conducive to the formation of cavitation bubbles, leading to an attenuated intensity of cavitation erosion, while excessive rough surface caused much energy dissipation and led to divergent jets, resulting in a significant reduction of erosion intensity. According to the experimental results, there existed an optimum inner surface roughness value to achieve the strongest aggressive cavitation erosion capability for submerged cavitating jets. Tang et al. [20] analyzed the existing experimental data in the literature on the friction factor in microchannels. The friction factors in stainless steel tubes were much higher than the theoretical predictions for tubes of conventional size. This discrepancy resulted from the large rel...

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

The impinging jet is a classical flow model with relatively simple geometric boundary conditions, and it is widely used in marine engineering. In recent years, scholars have conducted more and more fundamental studies on impact jets, but most of the classical turbulence models are used in numerical simulations, and the accuracy of their calculation results is still a problem in regions with large changes in velocity gradients such as the impact zone. In order to study the complex flow characteristics of the water flow under the condition of a submerged jet impacting a stationary wall, the Wray–Agarwal turbulence model was chosen for the Computational Fluid Dynamics (CFD) numerical simulation study of the impacting jet. Continuous jets with different Reynolds numbers and different impact heights H/D were used to impact the stationary wall, and the results show that the jet flow structure depends on the impact height and is relatively independent of the Reynolds number. With the increase in the impact height, the diffusion of the jet reaching the impact area gradually increases, and its velocity gradually decreases. As the impact height increases, the maximum pressure coefficient decreases and the rate of decrease increases gradually, and the dimensionless pressure distribution is almost constant. In this paper, the flow field structure and pressure characteristics of a continuous submerged jet impacting a stationary wall are explored in depth, which is of great guidance to engineering practice.

This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

Bond properties were performed on Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu alloy wire with a diameter of 25 µm under different process parameters. The effects of electrical flaming off (EFO) current and EFO time on the deformability of the free air ball (FAB) were investigated using scanning electron microscopy (SEM), as well as the effects of ultrasonic power and bonding force on the bond characteristic. The experimental results show that FAB grows from a preheated tip to a small ball, a regular ball, and finally to a golf ball with increasing either the EFO current or the EFO time, and the FAB presents an optimal shape at 25 mA and 650 μs. Moreover, a nonlinear relationship between FAB diameter and EFO time is obtained at an EFO current of 25 mA, which could be expressed by a cubic equation. Further, at a constant bonding force, as the ultrasonic power increased, the mashed ball diameter grew larger and larger, the capillary hole imprint became more and more obvious, and the tail width also increased, and vice versa. The optimal ultrasonic power and bonding force are 70 mW and 45 gf for ball bonding and 90 mW and 75 gf for wedge bonding, respectively. Finally, for all the bonded wire samples prepared under optimal process parameters, no ball and wedge bond lifts happened after the destructive pull test, and full intermetallic compound coverage with perfect morphology occurred on the bond pad after the ball shear test, which meant that the bonded wire samples had high bond strength and hence improved the reliability of microelectronic products. It provided technical support for the reliability research of Pt-containing Ag-based bonding alloy wires.

Bond Properties were performed on Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu alloy wire with a diameter of 25 µm under different process parameters. Effects of electrical flaming off (EFO) current and EFO time on deformability of the free air ball (FAB) were investigated using scanning electron microscopy (SEM) as well as the effects of ultrasonic power and bonding force on the bond characteristic. The experimental results showed that, FAB grows from a preheated tip to a small ball, a regular ball and finally to a golf ball with increasing either the EFO current or the EFO time, and the FAB presented optimal shape at 25 mA and 650 μs. Moreover, a nonlinear relationship between FAB diameter and EFO time is obtained at the EFO current of 25 mA, which could be expressed by a cubic equation. Further, at a constant bonding force, as the ultrasonic power increased, the mashed ball diameter grew larger and larger, the capillary hole imprint became more and more obvious, and the tail width also increased larger and larger, and vice versa. The optimal ultrasonic power and bonding force are 70 mW and of 45 gf for ball bond and 90 mW and 75 gf for wedge bond, respectively. Finally, for all the bonded wire samples prepared under optimal process parameters, no ball and wedge bond lifts happened after destructive pull test, and full intermetallic compound coverage with perfect morphology occurred on the bond pad after ball shear test, which meant that the bonded wire samples have high bond strength, and hence improved the reliability of microelectronic products.