Ultrasonic bonding for thermoplastic microfluidic devices without energy director

Luo, Yi; Zhang, Zongbo; Wang, Xiaodong; Zheng, Yuehong

doi:10.1016/j.mee.2010.04.020

Cited by 40 publications

(31 citation statements)

References 22 publications

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“…Later, Luo et al reported multilayer bonding of PMMA using a commercial ultrasonic bonding tool (Fig. 3a) [62]. Alternatively, various surface modification techniques, such as plasma, UV, or UV/ozone treatments, are available.…”

Section: Sealing Non-conformal Polymersmentioning

confidence: 99%

See 1 more Smart Citation

Lab-on-a-chip devices: How to close and plug the lab?

Temiz

Lovchik

Kaigala

et al. 2015

Microelectronic Engineering

410

276

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a b s t r a c tLab-on-a-chip (LOC) devices are broadly used for research in the life sciences and diagnostics and represent a very fast moving field. LOC devices are designed, prototyped and assembled using numerous strategies and materials but some fundamental trends are that these devices typically need to be (1) sealed, (2) supplied with liquids, reagents and samples, and (3) often interconnected with electrical or microelectronic components. In general, closing and connecting to the outside world these miniature labs remain a challenge irrespectively of the type of application pursued. Here, we review methods for sealing and connecting LOC devices using standard approaches as well as recent state-of-the-art methods. This review provides easy-to-understand examples and targets the microtechnology/engineering community as well as researchers in the life sciences.

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Section: Sealing Non-conformal Polymersmentioning

confidence: 99%

“…(a) After[62], (b) after[67], and (c) after[72]. (a) Reproduced with permission from Elsevier, and (b) and (c) from Royal Society of Chemistry.…”

mentioning

confidence: 99%

Lab-on-a-chip devices: How to close and plug the lab?

Temiz

Lovchik

Kaigala

et al. 2015

Microelectronic Engineering

410

276

View full text Add to dashboard Cite

show abstract

“…For these reasons, UW is compatible with the pre-loading of temperature-sensitive materials or even of biological material, such as DNA [15]. Recently, UW has been used (amongst other techniques) for the assembly of piezo micropumps [16], to perform polymerase chain reaction (PCR) [17], and in combination with TB [18,19,20]. …”

Section: Introductionmentioning

confidence: 99%

Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

Matteucci¹,

Heiskanen²,

Zór³

et al. 2016

Sensors

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We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obtained using TB. Parameters such as metal thickness of electrodes, depth of electrode embedding, delivered power, and height of energy directors (for UW), as well as pressure and temperature (for TB), were systematically studied to evaluate the two bonding methods and requirements for optimal electrochemical performance. The presented technology is intended for easy and effective integration of polymeric Lab-on-Chip systems to encourage their use in research, commercialization and education.

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“…For the super cial oxide lm which is a conjugative inhibitor, the ultrasonic wave joining [1][2][3][4][5][6] , surface activated joining [7][8][9][10][11][12] and the metal salt generation bonding method 13) are effective. However, the real joining surface had large and small irregularities and use big plastic deformation to ll these gap or couldn t but joint it in a liquid phase state.…”

Section: Introductionmentioning

confidence: 99%

Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler

2016

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To examine the effect of Bi ller metal on bond strength of the Sn/Sn bonded joint interface, the interfacial microstructures and fractured surfaces of joint were observed by using SEM. After Bi ller metal had been deposited to the surface, the diffusion bonding was carried out in a vacuum chamber at bonding temperature of 413~463 K. The application of ller has decreased bonding temperature by 20 K or more which the bonded joints obtained bond strength comparable to the base metal. As the bonding temperature increases, the thickness of the Bi diffusion layer increases as well. Moreover, the interfacial hardness has decreased with a rise in bonding temperature, and the failure mode changes from brittle to ductile. The changes in the interfacial eutectic reaction layer between Sn and Bi accompanied by the expansion of the contact area between Sn metal surfaces are considered as the contributing factor to the increase in the bond strength.

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Ultrasonic bonding for thermoplastic microfluidic devices without energy director

Cited by 40 publications

References 22 publications

Lab-on-a-chip devices: How to close and plug the lab?

Lab-on-a-chip devices: How to close and plug the lab?

Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler

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