2015
DOI: 10.1149/2.0091512ssl
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Ultralow Reflectivity and Light Trapping for Crystalline Si Solar Cells by Use of Surface Structure Chemical Transfer Method on Pyramidal Textured Surfaces

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Cited by 11 publications
(7 citation statements)
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“…Self-similarity property of formed particles causes importance of fractal properties of resulting structure. This kind of structure show very low spectral reflectance in wide range of wavelengths [8][9][10][11].…”
Section: Black Silicon and Theoretical Fractal Structuresmentioning
confidence: 99%
See 1 more Smart Citation
“…Self-similarity property of formed particles causes importance of fractal properties of resulting structure. This kind of structure show very low spectral reflectance in wide range of wavelengths [8][9][10][11].…”
Section: Black Silicon and Theoretical Fractal Structuresmentioning
confidence: 99%
“…In the present study the nanocrystalline Si layers were formed by using the surface structure chemical transfer method (SSCT) [8][9][10][11]. In this procedure silicon surface is etched in solution of H 2 O 2 and HF.…”
Section: Papersmentioning
confidence: 99%
“…We have recently developed a fabrication method for ultralow reflectivity crystalline Si wafers which method simply includes contact of platinum (Pt) catalyst with Si wafers immersed in a hydrogen peroxide (H2O2) plus hydrofluoric acid (HF) solution called surface structure chemical transfer (SSCT) method [11][12][13][14]. In the present study, a nanocrystalline Si layer has been produced on a pyramidal Si surface by use of the SSCT Si surfaces, respectively, using a spin coating method, followed by heat treatment at 925 °C for 30 min in nitrogen.…”
Section: Introductionmentioning
confidence: 99%
“…Black− Si wafers have been produced using reactive ion etching [1][2][3][4], metal-assisted chemical etching [5][6][7][8][9][10], stain etching [11], electrochemical etching [11,12], vapor chemical etching [13], surface structure chemical transfer (SSCT) [14][15][16], etc. Reactive ion etching [1][2][3][4] requires an expensive apparatus, and throughput is considerably low, leading to high fabrication costs.…”
Section: Introductionmentioning
confidence: 99%