Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics

Abstract

Advanced high-temperature materials, metals and ceramics, have been widely sought after for printed flexible electronics under extreme conditions. However, the thermal stability and electronic performance of these materials generally diminish under extreme environments. Additionally, printable electronics typically utilize nanoscale materials, which further exacerbate the problems with oxidation and corrosion at those extreme conditions. Here we report superior thermal and electronic stability of printed copper-flexible ceramic electronics by means of integral hybridization and passivation strategies. High electric conductivity (5.6 MS/m) and thermal stability above 400 °C are achieved in the printed graphene-passivated copper platelet features, while thermal management and stability above 1000 °C of printed electronics can be achieved by using either ultrathin alumina or flexible alumina aerogel sheets. The findings shown here provide a pathway toward printed, extreme electronic applications for harsh service conditions.

Molecular copper decomposition ink for printable electronics

“…Electronics have advanced rapidly, allowing for miniaturized sensors, antennas and circuits to be printable, compact, lightweight and flexible. [1][2][3] Recent years have seen an increasing emergence of interest in using printable materials, such as graphene, 4,5 MXenes, 6,7 metal nanostructures, [8][9][10][11][12] and conductive polymers. 13,14 Of these materials, copper shows immense potential due to its abundance, low-cost, and inherently high conductivity.…”

“…13,14 Of these materials, copper shows immense potential due to its abundance, low-cost, and inherently high conductivity. [8][9][10][11][12] Bulk copper has been extensively used in electronics, but copper itself suffers from oxidation, which hinders its conductivity. 12 This is further exacerbated on the nanoscale due to higher surface energies, resulting in greater potential for oxidation.…”

High‐Temperature Copper–Graphene Conductors via Aerosol Jetting

“…The copper nanoplates are prepared via the controlled aqueous growth synthesis, while its dimension can be controlled by altering the reaction conditions. [ 7 ] The feedstock obtained is then used for developing the aqueous ink for AJP, while the addition of dopamine hydrochloride is selected for the preparation of copper–graphene materials. Figure 1b (right) shows the scanning electron microscope (SEM) image of the as‐printed CuNPLs.…”

“…[5] With its unparalleled electric and thermal properties, printed copper has been explored for conductive circuits promising for high-temperature applications. [6,7] Additive manufacturing (AM) enables printed electronic technologies, which find mesoscale to nanoscale applications in actuators, [8] sensors, [9] antennas, [10] and energy conversion devices. [11] In this context, aerosol jet printing (AJP) provides the benefit of rapidly modifying geometrically complex feature patterns and design iterations of highly functional electronic devices, [12] by aerosolizing the ink nanostructures, including metals, [13] ceramics, [14] adhesives, [15] and polymers.…”

“…[ 5 ] With its unparalleled electric and thermal properties, printed copper has been explored for conductive circuits promising for high‐temperature applications. [ 6,7 ]…”