High‐Temperature Hybridized Copper–Boron Nitride Materials from Additive Manufacturing

Abstract

The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adem.202201056.

Additive Manufacturing of High‐Temperature Preceramic‐Derived SiOC Hybrid Functional Ceramics

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High-temperature capable materials and electronics have attracted much attention due to their potential use in extreme environments. [1,2] The prospective candidates for high-temperature electronics with high electrical conductivity and antioxidation are limited to a relatively narrow range of noble metals, such as gold (Au), [3] silver (Ag), [4] palladium (Pa), [5] or platinum (Pt). [6] However, these precious metallic materials have relatively low softening and/or melting points compared to that of hightemperature ceramics, making it challenging to manufacture high-temperature robust electronics.

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