Two-phase mini-thermosyphon electronics cooling, Part 3: Transient modeling and experimental validation

Lamaison, Nicolas; Marcinichen, Jackson B.; Ong, Chin Lee; Thome, John R.

doi:10.1109/itherm.2016.7517601

Cited by 13 publications

(5 citation statements)

References 28 publications

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“…Since the density of the two-phase mixture in the riser is lower than the liquid in the downcomer, a flow rate is created under the gravity field. In the literature [4], [5], an accumulator, which is mainly a downcomer with larger section, is added to these four parts. This accumulator reduces the height change of the liquid level and, as a consequence, stabilizes the system for a large operating domain.…”

Section: Thermosyphon Fundamentals Working Principle Of the Thermosyphonmentioning

confidence: 99%

“…This mini-thermosyphon validates the two flow regimes: i) gravitational dominant regime, and ii) frictional dominant regime. Moreover, it handles heat loads up to 158 W with a heat flux of 70 W /cm 2 while keeping the temperature of the chip below 58 • C. Moreover, the real data acquired allowed the validation of a steady-state numerical model, able to predict the chip temperature within 5% of error [6], while its dynamic simulation framework predicts temperature and pressure with a maximum error of 0.4 K and 0.35 bar, respectively [4]. This setup and simulation framework allowed the design of a thermosyphon for a commercial 2U server [9].…”

Section: State-of-the-art On Mini-thermosyphon Design and Manufacturingmentioning

confidence: 99%

“…Transient thermosyphon numerical models have been proposed in previous work [4], [5], [9], [6]. In this paper, we present a simplified steady-state numerical model.…”

Section: Numerical Simulation Modelmentioning

confidence: 99%

“…Previous research in this area either focused on the development of large-scale thermosyphon prototypes that served as proof-of-concept demonstrators [4], [5], or addressed the development of numerical models able to simulate the properties of mini-thermosyphons, in order to provide a design for 2U servers [6], [7]. To the best of our knowledge, no real microscale thermosyphon prototype has yet been built and validated in a commercial platform.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Design of a Two-Phase Gravity-Driven Micro-Scale Thermosyphon Cooling System for High-Performance Computing Data Centers

Iranfar

Zapater

Thome

et al. 2018

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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Next-generation High-Performance Computing (HPC) systems need to provide outstanding performance with unprecedented energy efficiency while maintaining servers at safe thermal conditions. Air cooling presents important limitations when employed in HPC infrastructures. Instead, two-phase onchip cooling combines small footprint area and large heat exchange surface of micro-channels together with extremely high heat transfer performance, and allows for waste heat recovery. When relying on gravity to drive the flow to the heat sink, the system is called a closed-loop two-phase thermosyphon. Previous research work either focused on the development of large-scale proof-of-concept thermosyphon demonstrators, or on the development of numerical models able to simulate their operation. In this work, we present a new ultra-compact microscale thermosyphon design for high heat flux components. We manufactured a working 8 cm height prototype tailored for Virtex 7 FPGAs with a heat spreader area of 45 mm × 45 mm, and we validate its performance via measurements. The results are compared to our simulator and accurately match the thermal performance of the thermosyphon, with error of less than 3.5% . Our prototype is able to work over the full range of power of the Virtex7, dissipating up to 60 W of power while keeping chip temperature below 60 • C. The prototype will next be deployed in a 10 kW rack as part of an HPC prototype, with an expected Power Usage Effectiveness (PUE) below 1.05.

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Section: Thermosyphon Fundamentals Working Principle Of the Thermosyphonmentioning

confidence: 99%

Section: State-of-the-art On Mini-thermosyphon Design and Manufacturingmentioning

confidence: 99%

“…Transient thermosyphon numerical models have been proposed in previous work [4], [5], [9], [6]. In this paper, we present a simplified steady-state numerical model.…”

Section: Numerical Simulation Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Design of a Two-Phase Gravity-Driven Micro-Scale Thermosyphon Cooling System for High-Performance Computing Data Centers

Iranfar

Zapater

Thome

et al. 2018

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

View full text Add to dashboard Cite

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“…It has simple structure, light weight, low cost and excellent heat transfer performance [5]. Using the principle of closed thermosyphon to make a composite thermosyphon radiator is the current research hotspot in the field of electronic heat dissipation [6][7][8], such as the cooling of data center servers [9], fuel cells [10] and electronic equipment on commercial aircrafts [11]. Research by Rahimi et al showed that after the thermosyphon adopts metal powder or capillary core sintering methods, its evaporation section and condensation section respectively show strong hydrophilicity and hydrophobicity, and the heat transfer performance is greatly improved [12].…”

Section: Introductionmentioning

confidence: 99%

Experimental study on heat transfer characteristics of composite thermosyphon radiator for CPU cooling

Zhang

et al. 2022

J. Phys.: Conf. Ser.

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In order to meet the heat dissipation requirements of high-power CPUs and make data center servers more energy-efficient, this paper studies a composite thermosiphon radiator for 400WCPU. The cooling performance of the composite thermosiphon radiator and the degree of optimization compared with the ordinary heat pipes radiator are studied under different heat source power and different air volume conditions. The results show that the thermal resistance of the composite thermosiphon radiator is the lowest at 400W and it has little dependence on the air volume. Compared with the common heat pipe radiator, condenser has been greatly optimized, the evaporator needs to be further optimized. When the CPU power is 200W, the CPU core temperature is optimized by 6°C. It is estimated that when the CPU power is 400W, the CPU core temperature is slightly higher than the temperature spec.

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Experimental investigations of pump‐driven closed‐loop thermosyphon system

Birajdar

Sewatkar²

2022

Heat Trans

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The thermal management of the compact electronic system is one of the major challenges in the present power electronics and computational industries. The present paper investigates the effects of a pump-driven flow on the thermal performance of a closed-loop thermosyphon (CLT) system. This paper discusses the effect of pump-driven flow on the thermal performance of CLT. In this study, the experimentation is carried out on the water-charged pump-driven closed-loop thermosyphon (PDLT) with different heat inputs, filling ratios (FR), and adiabatic lengths to understand the effects of these parameters on the thermal performance of the system. The results indicate that the heat transfer performance of CLT is improved using pump-driven flow in the PDLT and the minimum thermal resistance (0.035 k/W) is obtained at FR = 0.6 and 3 kW heat input. It is also noticed that the thermal resistance of PDLT is up to 35% higher than CLT at FR = 0.6, 0.5 kW heat input, and 500 mm adiabatic length. The unstable geyser boiling phenomenon is eliminated from the system at the adiabatic lengths of 200 and 500 mm. However, for long adiabatic length (800 mm), the geyser boiling occurs at a higher FR (FR = 0.6) and moderate heat flux (0.5 kW).

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Two-phase mini-thermosyphon electronics cooling, Part 3: Transient modeling and experimental validation

Cited by 13 publications

References 28 publications

Design of a Two-Phase Gravity-Driven Micro-Scale Thermosyphon Cooling System for High-Performance Computing Data Centers

Design of a Two-Phase Gravity-Driven Micro-Scale Thermosyphon Cooling System for High-Performance Computing Data Centers

Experimental study on heat transfer characteristics of composite thermosyphon radiator for CPU cooling

Experimental investigations of pump‐driven closed‐loop thermosyphon system

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