Experimental study on heat transfer characteristics of composite thermosyphon radiator for CPU cooling

Abstract

In order to meet the heat dissipation requirements of high-power CPUs and make data center servers more energy-efficient, this paper studies a composite thermosiphon radiator for 400WCPU. The cooling performance of the composite thermosiphon radiator and the degree of optimization compared with the ordinary heat pipes radiator are studied under different heat source power and different air volume conditions. The results show that the thermal resistance of the composite thermosiphon radiator is the lowest at 400W and it has little dependence on the air volume. Compared with the common heat pipe radiator, condenser has been greatly optimized, the evaporator needs to be further optimized. When the CPU power is 200W, the CPU core temperature is optimized by 6°C. It is estimated that when the CPU power is 400W, the CPU core temperature is slightly higher than the temperature spec.

Investigation of the Effect of Different Fins Configurations on the Thermal Performance of the Radiator

“…Using Python, Shyja [8] compares the optimization of straight fins with varied geometry and presents her findings at ACMS 2022, examining the efficacy of various configurations. According to a study published in the Journal of Physics: Conference Series, Ba et al, [9] experimentally investigate the heat transfer properties of a composite thermosyphon radiator for CPU cooling, offering valuable information on the device's efficacy in thermal management.…”