“…The polymer I/Os are next cured for one hour in a nitrogen purged furnace set to 160 • C. There are many derivatives to the electrical, optical, and fluidic I/O approach described above. One such derivative is shown in Figure 2.10, which illustrates the ability to embed each optical pin in a solder bump to create a dual-mode electricaloptical solder bump [31]. An SEM image of such dual-mode electrical-optical solder bumps is shown in Figure 2 In another approach, the optical and electrical I/Os can be assembled without having to embed the polymer pins in the solder bumps [32], as illustrated in Figure 2.7 and Figure 2.12.…”