Transient thermal stress analysis of a thermoelectric cooler under pulsed thermal loading

Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review

“…An experiment varying a pulsed voltage demonstrated that both the maximum chip temperature and the thermal stress at the contact could be reduced simultaneously. In this case, the maximum stress appears at the cold side contact [128].…”

“…Pulsed thermal load containing high heat flux thermal energy can induce a large thermal stress in the interface of the materials by imposing a high thermal gradient [123]. Recently, Gong et al [128] proposed a finite-element model to analyze transient thermal stress of a conventional TEC module made of 71 pairs of Bi 2 Te 3 leg and integrated in a SiC power chip under pulsed thermal loading with varying amplitudes. This study concluded that the pulsed thermal loading drastically increased the thermal stress of the device which led to an abrupt increase in temperature, eventually reducing its cooling performance.…”

Review of thermoelectric geometry and structure optimization for performance enhancement

“…Results revealed that attaching a thermal load to the Peltier junction would cause an extremely high thermal stress level that may in turn cause cracks and dislocations [168]. In addition, it was found that the use of transient super-cooling characteristics of the TEC could reduce thermal stress peaks [169].…”

The simulated cooling performance of a thin-film thermoelectric cooler with coupled-thermoelements connected in parallel

“…However, the electrical devices generated a high heat flux which created a harsh environment for the thin-film TECs. The large temperature gradients and thermal stresses [ 16 ] could results in the failure of the thin-film TEC and this issue should be carefully solved [ 15 , 29 , 30 ]. Some researchers demonstrated ring-shaped thermoelectric modules [ 31 , 32 ], which showed significant superiority in the performance and reliability.…”