2021
DOI: 10.1109/tcpmt.2021.3095048
|View full text |Cite
|
Sign up to set email alerts
|

Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review

Abstract: The thermoelectric effect forms the basis of Peltier cooling that has attracted interest for solid-state refrigeration for more than a century. The dearth of materials level efficiency in converting between heat and electricity has limited widespread applications. With renewed focus on energy technologies in the past three decades, the thermoelectric effect has been intensely explored in new materials using state-of-the-art advances in materials fabrication, characterization techniques, and theory. This articl… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 13 publications
(2 citation statements)
references
References 137 publications
0
2
0
Order By: Relevance
“…Unfortunately, such high ZT values in thermoelectric cooling systems are still far behind what can soon be achieved [ 5 ]. In contrast, ZT is not the sole relevant parameter [ 6 , 9 , 10 , 11 ] in the active cooling mode. In this active cooling mode, a combination of high active cooling (high power factor PF = S 2 σ) and high passive cooling (high thermal conductivity) determines the thermoelectric cooling performance.…”
Section: Introductionmentioning
confidence: 99%
“…Unfortunately, such high ZT values in thermoelectric cooling systems are still far behind what can soon be achieved [ 5 ]. In contrast, ZT is not the sole relevant parameter [ 6 , 9 , 10 , 11 ] in the active cooling mode. In this active cooling mode, a combination of high active cooling (high power factor PF = S 2 σ) and high passive cooling (high thermal conductivity) determines the thermoelectric cooling performance.…”
Section: Introductionmentioning
confidence: 99%
“…Phase change materials (PCMs) can also be used to clamp the temperature for a specific duration [8]. It may also be possible to introduce Peltier elements into the package [9]. OC capability may also be enabled through control [10] of the VSI, or by temporarily reducing the switching frequency.…”
Section: Introductionmentioning
confidence: 99%