Transient Liquid Phase Bonding of Ni-base Single Crystal Superalloy, CMSX-2.

Nishimoto, Kazutoshi; Saida, Kazuyoshi; Kim, Dae-Up; Nakao, Yoshikuni

doi:10.2355/isijinternational.35.1298

Cited by 54 publications

(47 citation statements)

References 0 publications

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“…On the other hand, analytical models of TLP bonding indicate that the isothermal solidification process time is roughly proportional to the square of the interlayer thickness [9,18,19,25,36,44,86,104,110,114,124,138,161,173,175,176]; experimental data often corroborates this trend [3,26,43,44,71,86,88,153]. Therefore, to minimize bonding time, an interlayer slightly thicker than the critical thickness is ideal.…”

Section: Critical Interlayer Thicknessmentioning

confidence: 52%

“…Isothermal solidification occurs until all of the liquid has disappeared (CP5c). At this point, the TLP bonding process can be stopped if desired [71]. The bond already has an elevated remelting temperature (T 5 ) compared to the melting temperature of the interlayer (T 3 ).…”

Section: Solidificationmentioning

confidence: 99%

“…• Heating to the bonding temperature, CP1-5a: less than a minute to about an hour; dependent on the method of heating, the heating rate of the heating apparatus, and the substrate material's thermal properties • Melting of the interlayer, CP3: less than a second [121,124,138] to several seconds [19,43,77] • Melting back of the substrate, CP3-5a: seconds [11,71,73,77,124,138,161,174] to minutes [7,36,37,43,71,73,85,121] • Isothermal solidification, CP5a-5c: minutes [7,25,36,37,56,74,77,95,96,105,121,125,153] to hours [7,11,33,36,37,43,57,58,105,146,157,175], although it can occur in less than a minute …”

Section: Time Frame Of Tlp Bondingmentioning

confidence: 99%

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Overview of transient liquid phase and partial transient liquid phase bonding

2011

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Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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Section: Critical Interlayer Thicknessmentioning

confidence: 52%

Section: Solidificationmentioning

confidence: 99%

Section: Time Frame Of Tlp Bondingmentioning

confidence: 99%

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Overview of transient liquid phase and partial transient liquid phase bonding

2011

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“…This gives a measured interface rate constant of j9 5 ÿ0.126 mm= ffiffi s p , based on an initial liquid width (W max ) of 59.5 mm (Eq. [4]). …”

Section: B Predicted and Experimentally Measured Interface Kineticsmentioning

confidence: 99%

“…[4][5][6][7][8] One reason that TLP bonding is not yet in widespread use is that the experimental approach used to determine the process parameters can be time consuming and costly. This experimental approach typically involves a determination of the liquid fraction remaining in the joint metallographically from a series of samples quenched from the process temperature at different hold times.…”

Section: Introductionmentioning

confidence: 99%

A study of transient liquid-phase bonding of Ag-Cu using differential scanning calorimetry

Kuntz

Zhou

Corbin

2006

Metall Mater Trans A

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A novel approach using differential scanning calorimetry (DSC) to quantify interface kinetics in a solid/liquid diffusion couple is applied to characterize the isothermal solidification stage during transient liquid-phase (TLP) bonding of Ag and Cu using a Ag-Cu interlayer. When the DSC results are properly interpreted, the measured interface kinetics are more accurate than those obtained using traditional metallographic techniques. Experimental results are compared to predictions for isothermal solidification given by a selection of analytical models. The comparison yields close agreement with a solution that assumes a moving boundary; but accuracy of the predictions is very sensitive to selection of solute diffusivity. Metallographic inspection of the DSC samples and traditional TLP bonds validates the kinetics measured using this technique, and supports the prediction given by the analytical model. This study shows that the method of using DSC to quantify interface kinetics is valuable in the refinement of process parameters for TLP bonding. Furthermore, simple analytical solutions can be applied to predict the process kinetics of isothermal solidification in simple binary systems with considerable accuracy when the effects of grain boundaries can be neglected, thus reducing the need for complex numerical models when developing process parameters.

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