Abstract:In recent years, within power electronics packaging, there has been a trend toward compact power electronics modules for automotive and industrial applications, where a smart integrated control unit for motor drives is replacing bulky substrates with discrete control logic and power electronics. Most recent modules combine control and power electronics, yielding maximum miniaturization. Transfer molding is the method of choice for cost-effective encapsulation of such modules due to robustness of the molded mod… Show more
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