2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2024
DOI: 10.1109/eurosime60745.2024.10491541
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Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles

Freerik Forndran,
Mario Sprenger,
Juan Ricardo Barrera
et al.
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