Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils

Liu, Lingling; Bu, Yeqiang; Sun, Yue; Pan, Jianfeng; Liu, Jiabin; Ma, Jien; Qiu, Lin; Fang, Youtong

doi:10.1016/j.jmst.2020.10.019

Cited by 23 publications

(16 citation statements)

References 39 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The contact angle of water droplets is usually greater than 901 due to its higher surface tension than organic solvents. 21 As depicted in Fig. 5(b), the water contact angle on the RG-VLP surface was as high as 128.91, while the water contact angle on the VLP surface was only 95.51.…”

Section: Surface Contact Angle Analysis Of the Micro-coarsening Layermentioning

confidence: 86%

Preparation of an ultra-low profile and high peel strength copper foil with rice-grain microstructures

Wang,

Fa,

Tang

et al. 2023

Mater. Adv.

View full text Add to dashboard Cite

show abstract

Section: Surface Contact Angle Analysis Of the Micro-coarsening Layermentioning

confidence: 86%

Preparation of an ultra-low profile and high peel strength copper foil with rice-grain microstructures

Wang,

Fa,

Tang

et al. 2023

Mater. Adv.

View full text Add to dashboard Cite

show abstract

“…It was found that the low concentration of additives was detrimental to the formation of a dense and smooth structure on the surface because free copper ions demanded energy consumption to gain momentum to nucleate and grow. When the additive concentration was too low, insufficient energy necessary to inhibit grain growth during electrodeposition resulted in the formation of coarse grains [17]. With the amount of addition, the surface protrusion gradually diminished and the interface between the particles was not easily observed.…”

Section: Surface Morphologies Of Electrolytic Copper Foilsmentioning

confidence: 99%

“…Its functional mechanisms included not only complexing copper ions but also absorbing on the cathode surface [15,16]. For example, the previous studies [17,18] showed that bis-(3-sulfopropyl)-disulfide at appropriate concentrations had the effect of refining grains and increasing current density because the intermediates occupied the cathode surface and increased the cathodic polarization. Hydroxyethyl cellulose, as a nonionic surfactant, can effectively prevent the formation of pinholes [19].…”

mentioning

confidence: 99%

Effect of additives on the microstructure and properties of electrolytic copper foils

Liu

Sun

Bai³

et al. 2023

Preprint

View full text Add to dashboard Cite

A low-roughness ultra-thin copper foil was prepared by pulsed electrodeposition on titanium substrate. The influence of sodium 3,3'-dithiodipropane sulfonate (SPS), hydroxyethyl cellulose (HEC), gelatin and collagen additives on the microstructure, mechanical properties and electrochemical behavior of electrolytic copper foil was explored. Furthermore, the reaction mechanism of SPS and collagen additives on electrodeposited copper was discussed. The results showed that at 0.08 g/L collagen concentration, the lowest thickness, the highest microhardness and the optimal surface roughness were achieved to be 5.12 µm, 279.63 HV0.05 and 1.885 µm, respectively. X-ray diffraction results confirmed that electrolytic copper foils prepared by SPS was introduced into the blank solution had a preferred orientation of (220) texture, which benefitted from the synergistic effect of copper ions and additives. The intermediates formed by the additive and Cu+ occupied the active sites on the cathode surface that increased nucleation sites for deposition. Besides, the formed complexes can act as a barrier to narrow ion deposition channels and inhibit the growth of Cu ions.

show abstract

“…Subsequently, the SPS undergoes a desorption reaction to decompose into MPS. As the MPS accumulates, the thiol functional group adsorbs on the cathode surface and the terminal sulfonate anion captures the hydrated copper ions in the plating solution, which increases the reduction rate of copper ions [27,19]. The collagen additive is attracted to the concave corners of the copper foil, inhibiting electrodeposition and preventing the formation of pinholes [28].…”

Section: Surface Performance Of Electrolytic Copper Foilmentioning

confidence: 99%

“…Therefore, based on the respective applications and adsorption characteristics of organic additives like bis(3-sulfopropyl)-disul de [19] as well as nonionic surfactants hydroxyethylcellulose [20] and collagen [21], compounding is carried out to study the effect of the composite additives on electrolytic copper foil.…”

Section: Introductionmentioning

confidence: 99%

Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foil

Liu

Sun

Bai³

et al. 2023

Preprint

View full text Add to dashboard Cite

In this paper, the additives consisting of bis-(3-sulfopropyl)-disulfide (SPS), hydroxyethylcellulose (HEC) and collagen additive compounding, are proposed to fabricate ultra-thin copper foils with low roughness on titanium substrates. The effect of the deposition time, temperature and voltage on the morphology and roughness of electrolytic copper foil is explored. The results show that the deposited layers obtained at the electrodeposition time of 3 min, the electrolyte temperature of 50°C and the output voltage of 2.5 V exhibit small grain size and good adhesion to the substrate. Meanwhile, the effects of the two-component additive and the three-component additive on the microstructures, surface roughness and electrochemical behavior of copper foils are studied. Scanning electron microscopy images reveal that copper foils prepared by simultaneous introduction of 0.06 g/L SPS and 0.08 g/L collagen possess a dense and homogeneous structure with the smallest grain size (6.21 µm) and the lowest roughness (Rz = 2.30 µm), which is diminished by 26.17%. The electrodeposition principle and the action mechanism of additives suggest that the antagonistic interaction between SPS and HEC hinders the preferential adsorption of the additive at the surface protrusions and reduces the refinement ability of SPS additive. Benefiting from the synergistic effect of the SPS and collagen additive, the electrochemical properties of the copper foil are improved. Besides, the levels of three-component additives are determined by orthogonal experiments as 0.06 g/L SPS, 0.12 g/L HEC and 0.10 g/L collagen.

show abstract

Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils

Cited by 23 publications

References 39 publications

Preparation of an ultra-low profile and high peel strength copper foil with rice-grain microstructures

Preparation of an ultra-low profile and high peel strength copper foil with rice-grain microstructures

Effect of additives on the microstructure and properties of electrolytic copper foils

Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foil

Contact Info

Product

Resources

About