Abstract:In this paper, the additives consisting of bis-(3-sulfopropyl)-disulfide (SPS), hydroxyethylcellulose (HEC) and collagen additive compounding, are proposed to fabricate ultra-thin copper foils with low roughness on titanium substrates. The effect of the deposition time, temperature and voltage on the morphology and roughness of electrolytic copper foil is explored. The results show that the deposited layers obtained at the electrodeposition time of 3 min, the electrolyte temperature of 50°C and the output volt… Show more
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