Abstract:A low-roughness ultra-thin copper foil was prepared by pulsed electrodeposition on titanium substrate. The influence of sodium 3,3'-dithiodipropane sulfonate (SPS), hydroxyethyl cellulose (HEC), gelatin and collagen additives on the microstructure, mechanical properties and electrochemical behavior of electrolytic copper foil was explored. Furthermore, the reaction mechanism of SPS and collagen additives on electrodeposited copper was discussed. The results showed that at 0.08 g/L collagen concentration, the l… Show more
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