Toward Manufacturing Low-Cost, Large-Area Electronics

Chason, Marc; Gamota, Daniel; Brazis, Paul; Kalyanasundaram, Krishna; Zhang, Jie; Lian, Keryn; Croswell, Robert T.

doi:10.1557/mrs2006.121

Cited by 18 publications

(11 citation statements)

References 4 publications

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“…The required tolerances for passive components are roughly summarized in (Dougherty J. P. et al, 2003;Jung E. et al, 2009;Chason M. et al, 2006). System integration based on embedded passive in PCBs is illustrated in Fig.…”

Section: Resistormentioning

confidence: 99%

Integrated Passives for High-Frequency Applications

Mi¹,

Ueda²

2010

Advanced Microwave Circuits and Systems

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Introduction 1.1 Definitions of Integrated Passives Passive elements are indispensable in RF systems and are used for matching networks, LC tank circuits, attenuators, filtering, decoupling purposes and so on (Tilmans H. A C et al., 2003). Passive elements can be simply classified into distributed elements including transmission lines and waveguides, and lumped elements including inductors, capacitors and resistors. The distributed circuits take into account the phase shift occurring when the signal wave propagates along the circuits. As the operating frequency moves into the microwave spectrum, the distributed circuits have a higher Q factor, and thus they are usually used for high-frequency applications. Lumped elements are zero-dimensional by definition. In other words, the lumped elements have no physical dimensions which are significant with respect to the wavelength at the operating frequency, so that the phase shift that arises can be ignored. Discrete lumped elements are conventionally used in electronic circuits that work at a lower frequency. This is because the sizes of the discrete lumped elements become comparable to the wavelength at microwave frequencies. With the advent of new photolithography and passive integration technologies, the three basic building blocks for circuit design-inductors, capacitors, and resistors can be made small enough to be available in lumped form (Tummala R. R. et al., 2000). Lumped passive components may be discrete, integrated or embedded. The discrete is a singular device in a leaded or surface mount technology (SMT) case. This includes screen-printed resistors, capacitors, and inductors. Passive integration technologies allow several passive components to be integrated, either into a substrate (embedded) or onto a substrate (integrated). Integrated passive devices usually come in a compact SMT package or chipscale package (CSP) as a stand-alone component with input, output and ground terminations, which is much smaller than the operating wavelength providing some complete circuit functions, such as impedance-matching, filtering and so on, for highfrequency applications up to several tens of GHz (Tilmans H. A C et al., 2003). The lumped element circuits have the advantage of a smaller size, lower cost, and wide-band characteristics, though the Q factor is generally lower than distributed circuits. Integrated lumped passive circuits with a small form factor are especially suitable for some RF and microwave applications where real estate or wide-band requirements are of prime importance, for example mobile phones or other handheld wireless products. The choice 13 www.intechopen.com

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Section: Resistormentioning

confidence: 99%

Integrated Passives for High-Frequency Applications

Mi¹,

Ueda²

2010

Advanced Microwave Circuits and Systems

View full text Add to dashboard Cite

show abstract

“…The required tolerances for passive components are roughly summarized in Table 1 (Dougherty J. P. et al, 2003;Jung E. et al, 2009;Chason M. et al, 2006). System integration based on embedded passive in PCBs is illustrated in Fig.…”

Section: Resistormentioning

confidence: 99%

“…Resistor stability is another concern when using PTF. PTF termination directly on copper results in a relatively poor resistor stability under environmental stress (exposure to 85% RH, 85℃) due to corrosion at the copper/carbon ink interface (Chason M. et al, 2006). Using immersion silver on etched copper pads as the corrosion barrier mitigates the resistor drift under environmental stress while preserving the precise dimensions of the photo-lithographically patterned copper (Savic J. et al, 2002;Dunn G. et al, 2004).…”

Section: Embedded Film Resistor Technologymentioning

confidence: 99%

“…The insulator paste and the upper electrode patterns are screen-printed onto the lower electrode patterns prepared in advance on a substrate or resin film. The ceramic-filled resins can also be made photosensitive, to produce a so called ceramic-filled photo-dielectric (CFP) (Chason M. et al, 2006;Croswell R. et al, 2002). The CFP material is coated onto a planar copper surface, and a second sheet of copper is laminated on top of the dielectric.…”

Section: Embedded Film Capacitor Technologymentioning

confidence: 99%

“…Single and multilayer spiral inductors with inductance up to 30 nH can be printed with standard PCB printing and etching techniques (Chason M. et al, 2006). Transmission line structures can also be used to produce small inductances under about 3 nH.…”

Section: Embedded Inductor Technologymentioning

confidence: 99%

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