Toward five-dimensional scaling: How density improves efficiency in future computers

Ruch, Patrick; Brunschwiler, Thomas; Escher, W.; Paredes, Stephan; Michel, Bruno

doi:10.1147/jrd.2011.2165677

Cited by 71 publications

(37 citation statements)

References 67 publications

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“…As the power of the cell scales linearly with the area of the co-laminar interface, these low profile (low channel height) cells have also been restricted in their individual performance to low power operation ( < 100 mW). If these challenges can be overcome it has been suggested that 'on-chip' power and 9 cooling of microprocessors may become an attractive option for this technology [124], [125].…”

Section: Research Perspectivesmentioning

confidence: 99%

Co-laminar flow cells for electrochemical energy conversion

Goulet

Kjeang

2014

Journal of Power Sources

103

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A recently developed class of electrochemical cell based on co-laminar flow of reactants through porous electrodes is investigated. New architectures are designed and assessed for fuel recirculation and rechargeable battery operation.Extensive characterization of cells is performed to determine most sources of voltage loss during operation. To this end, a specialized flow cell technique is developed to mitigate mass transport limitations and measure kinetic rates of reaction on flow-through porous electrodes. This technique is used in in conjunction with cyclic voltammetry and electrochemical impedance spectroscopy to evaluate different treatments for enhancing the rates of vanadium redox reactions on carbon paper electrodes. It is determined that surface area enhancements are the most effective way for increasing redox reaction rates and thus a novel in situ flowing deposition method is conceived to achieve this objective at minimal cost. It is demonstrated that flowing deposition of carbon nanotubes can increase the electrochemical surface area of carbon paper by over an order of magnitude. It is also demonstrated that flowing deposition can be achieved dynamically during cell operation, leading to considerably improved kinetics and mass transport properties. To take full advantage of this deposition method, the total ohmic resistance of the cell is considerably reduced through design optimization with reduced channel width, integration of current collectors and reduction of reactant concentration. With electrodes enhanced by dynamic flowing deposition the cell presented in this study demonstrates nearly a fourfold improvement in power density over the baseline design.Producing more than twice the power density of the leading co-laminar flow cell without the use of catalysts or elevated temperatures and pressures, this cell provides a lowcost standard for further research into system scale-up and implementation of co-laminar flow cell technology. More generally, the experimental technique and deposition method developed in this work are expected to find broader use in other fields of electrochemical energy conversion. am also very grateful to my graduate colleagues at SFU and friends in FCRel, with a special mention to Omar in particular, for all the pleasant conversations and good times.I wish there had been more.Last but not least, I'd like to acknowledge all the family and friends I was unable to spend quality time with due to this work. I look forward to seeing you all again.vi Tables Table 1. for their higher specific energy and energy density [6]. For the same reasons, the lower power (< 100 W) market which is driven by portable consumer electronics, is currently 2 dominated by closed cell lithium ion batteries in particular [7]. As these batteries reach their limits and fail to keep up with the energy requirements of modern electronics, micro fuel cells with passively pumped higher energy density liquid reactants such as methanol have been suggested as a potential replacement [8].Regardless...

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Section: Research Perspectivesmentioning

confidence: 99%

Co-laminar flow cells for electrochemical energy conversion

Goulet

Kjeang

2014

Journal of Power Sources

103

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“…All of this suggests to Michel that, if computers are going to be packaged three-dimensionally, it would be worthwhile to try to emulate the brain's hierarchical architecture 6 . Such a hierarchy is already implicit in some proposed 3D designs: stacks of individual microprocessor chips (on which the transistors themselves could be wired in a branching network) are stacked into towers and interconnected on circuit boards, and these, in turn, are stacked together, enabling vertical communication between them.…”

Section: Smart Buildmentioning

confidence: 99%

Computer engineering: Feeling the heat

Ball¹

2012

Nature

129

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“…T HREE dimensional stacking of multiprocessor system-onchips (3D MPSoCs), integrated using high-speed through-silicon vias (TSVs), possesses immense potential in accelerating the computational power of high performance servers and datacenters of the future [4]. But this vertical integration of CMOS circuits in the long-term is impeded by the inability of the current air-cooled heat sinks in handling rising heat fluxes [5].…”

Section: Introductionmentioning

confidence: 99%

3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

Sridhar

Vincenzi

Atienza

et al. 2014

IEEE Trans. Comput.

101

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Abstract-Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising solution to the rising heat fluxes in two-dimensional and stacked three-dimensional integrated circuits. Development of such devices requires accurate and fast thermal simulators suitable for early-stage design. To this end, we present 3D-ICE, a compact transient thermal model (CTTM), for liquid-cooled ICs. 3D-ICE was first advanced incorporating the 4-resistor model-based CTTM (4RM-based CTTM). Later, it was enhanced to speed up simulations and to include complex heat sink geometries such as pin fins using the new 2 resistor model (2RM-based CTTM). In this paper, we extend the 3D-ICE model to include liquid-cooled ICs with multi-port cavities, i.e., cavities with more than one inlet and one outlet ports, and non-straight microchannels. Simulation studies using a realistic 3D multiprocessor system-on-chip (MPSoC) with a 4-port microchannel cavity highlight the impact of using 4-port cavity on temperature and also demonstrate the superior performance of 2RM-based CTTM compared to 4RM-based CTTM. We also present an extensive review of existing literature and the derivation of the 3D-ICE model, creating a comprehensive study of liquid-cooled ICs and their thermal simulation from the perspective of computer systems design. Finally, the accuracy of 3D-ICE has been evaluated against measurements from a real liquid-cooled 3D-IC, which is the first such validation of a simulator of this genre. Results show strong agreement (average error < ), demonstrating that 3D-ICE is an effective tool for early-stage thermal-aware design of liquid-cooled 2D-/3D-ICs.

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Toward five-dimensional scaling: How density improves efficiency in future computers

Cited by 71 publications

References 67 publications

Co-laminar flow cells for electrochemical energy conversion

Co-laminar flow cells for electrochemical energy conversion

Computer engineering: Feeling the heat

3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

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