2012
DOI: 10.1038/492174a
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Computer engineering: Feeling the heat

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Cited by 128 publications
(66 citation statements)
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“…As the electronics industry expands rapidly and chip fabrication technology evolves towards further miniaturization, power density and heat flux increase steeply [1,2]. Thermal management becomes a critical bottleneck for the advancement of a variety of important defense, space and commercial applications.…”
Section: Introductionmentioning
confidence: 99%
“…As the electronics industry expands rapidly and chip fabrication technology evolves towards further miniaturization, power density and heat flux increase steeply [1,2]. Thermal management becomes a critical bottleneck for the advancement of a variety of important defense, space and commercial applications.…”
Section: Introductionmentioning
confidence: 99%
“…The design of future materials and technologies to address critical needs ranging from waste heat recovery (low κ l thermoelectrics) [9] to heat management in nano-and micro-electronics (e.g., high κ l heat sinks and thermal interface materials) [10], hinges on this understanding. In terms of "high κ l " materials, diamond [11][12][13] is the long-standing champion for bulk materials, with graphene [14,15] more recently reinforcing the view that carbon-based materials are the best heat conductors.…”
Section: Introductionmentioning
confidence: 99%
“…One of the great challenges of modern society is related to heat dissipation . As for integrated electronics and LEDs, heat dissipation has become their main obstacle for future developments with high integration densities leading to high‐power density and numerous interfaces leading to high interface resistance .…”
Section: Introductionmentioning
confidence: 99%