Tin nitride thin films fabricated by reactive radio frequency magnetron sputtering at various nitrogen gas ratios

Choi, Seong-Soo; Kang, Jisoo; Park, Juyun; Kang, Yong‐Cheol

doi:10.1016/j.tsf.2014.10.035

Cited by 28 publications

(30 citation statements)

References 31 publications

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“…Therefore, the film was heterogeneously packed with metallic Ru and amorphous RuN phases, according to the large broadening of the diffraction peaks shown in Figure . Then, the film growth at 15% can be considered a loosely packed structure compared with pure Ruthenium; the decrease in thickness in samples grown greater than 15% can be well explained by the ratio of sputter gases employed during the deposition …”

Section: Resultsmentioning

confidence: 99%

Influence of nitrogen partial pressure on the microstructure and morphological properties of sputtered RuN coatings

Quintero

Ospina

Mello

et al. 2017

Surf Interface Anal

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In this work, the production of RuN thin films using the reactive direct current magnetron sputtering technique is presented. Samples were grown with varying Ar/N2 ratio with values of 60/40, 80/20, 85/15, 90/10, 95/5, and 100/0. X‐ray photoelectron spectroscopy was employed to determine the presence of RuN before and after a sputtering etching process. According to the high‐resolution of N1s spectra, 3 peaks were identified at 397.4 ± 0.3 eV, 398.3 ± 0.3 eV, and 398.8 ± 0.3 eV binding energies, corresponding to hybridizations of nitrogen with transition metals, oxynitrides, and oxycarbides. X‐ray diffraction analyses were performed, showing the coexistence of the RuN face‐centered cubic and Ru hexagonal compact packed phases. After the etching process, the samples grown at nitrogen flow rates greater than 15% continued to show the RuN face‐centered cubic phase. Atomic force microscope analyses showed that as the nitrogen concentration increased, the grain size and roughness also tended to increase.

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Section: Resultsmentioning

confidence: 99%

Influence of nitrogen partial pressure on the microstructure and morphological properties of sputtered RuN coatings

Quintero

Ospina

Mello

et al. 2017

Surf Interface Anal

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“…Metal thin films (TFs) are synthesized with various methods such as chemical vapor deposition, magnetron sputtering, reactive sputtering, direct current sputtering, and radio frequency (RF) sputtering . Among those methods, RF magnetron sputtering technique is generally used to obtain uniform TFs.…”

Section: Introductionmentioning

confidence: 99%

Antibacterial and physicochemical properties of co‐sputtered CuSn thin films

Kang

Park

Kim

et al. 2017

Surface & Interface Analysis

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Copper-tin thin films (CT TFs) were deposited on p-type Si(100) by radio frequency (RF) magnetron co-sputtering method. The atomic ratio of Cu and Sn showed complementary tendency with various RF powers on metal targets. Antibacterial test was conducted with Gram-negative Escherichia coli. The ratio of Cu and Sn ions and the contact time with E. coli affected the antibacterial efficiency. Increasing the ratio of Cu ions and contact time showed higher antibacterial activity. Cu 20 Sn 6 called as bronze structure, metallic Cu, and copper oxide phases were identified from X-ray diffraction data after sterilization. The lattice strain that was changed due to the substitution of Cu and Sn was also calculated. The surface morphology of CT TFs was entirely grown to round shape when the dominant element was Sn. But, as the content of Cu increased, the surface morphology was changed from ball shape to sharp column shape. When fixed contact time, the intensities of Cu 2p increased but the intensities of Sn 3d decreased as increasing the atomic ratio of Cu. The oxidation of Cu was more sharply progressed as the RF power on Cu target increased. When fixed CT TFs, the intensities of Cu 2p were consistent but the intensities of Sn 3d 3/2 decreased as increasing contact time between CT TF and E. coli.

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“…There are many routes to synthesize nanostructured materials and TFs, for example, electrodeposition, [ 1,3,7,10 ] spin coating, [ 5 ] self‐assembly, [ 6 ] chemical bath deposition, [ 11 ] and radio frequency (RF) cosputtering method. [ 14–16 ] Among them, RF cosputtering is a very useful method because TFs can be fabricated easily for industrial applications regardless of whether the material is an insulator, conductor, or semiconductor. [ 17 ] Many researches have been conducted on the TFs involving one type of copper selenides.…”

Section: Introductionmentioning

confidence: 99%

Tailoring the Surface Characteristics of CuSe Thin Films by Adjusting the Compositional Ratio

Lee

Kim

Park

et al. 2021

Physica Status Solidi (a)

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Using radio frequency (RF) magnetron cosputtering, copper selenide thin films (TFs) with various ratios of Se are fabricated herein. To observe how the chemical and physical properties change based on morphology, the ratio of metallic Cu to nonmetallic Se is tuned to form multiple different compositions. The compositional percentage of the surface is determined by X‐ray photoelectron spectroscopy (XPS). Noticeable transitions of the characteristics of TFs are affected by Cu to a higher degree than Se. Larger grain sizes are observed when the Se ratio is high in Cu‐rich TFs. Most copper selenide TFs are hydrophobic and portray these characteristics the strongest when the surface Se ratio of TF is 16.62% as the contact angle with distilled water is 129°. In addition, the electrical conductivity is the highest at 2.04 (±0.13) × 107 S m−1 when the surface Se ratio is 10.95%.

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Tin nitride thin films fabricated by reactive radio frequency magnetron sputtering at various nitrogen gas ratios

Cited by 28 publications

References 31 publications

Influence of nitrogen partial pressure on the microstructure and morphological properties of sputtered RuN coatings

Influence of nitrogen partial pressure on the microstructure and morphological properties of sputtered RuN coatings

Antibacterial and physicochemical properties of co‐sputtered CuSn thin films

Tailoring the Surface Characteristics of CuSe Thin Films by Adjusting the Compositional Ratio

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