Through-thickness thermal conductivity enhancement of carbon fiber composite laminate by filler network

Fang, Zenong; Li, Min; Wang, Shaokai; Gu, Yi; Li, Yanxia; Zhang, Zuoguang

doi:10.1016/j.ijheatmasstransfer.2019.04.007

Cited by 35 publications

(10 citation statements)

References 29 publications

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“…When graphene fillers are introduced, graphene acts as a thermal bridge among fibers and connecting the fibers to each other. [ 10,12,38 ] In addition, the graphene overlaps and interconnects each other to form an interconnection network (Figure 3D,F), which greatly improves the thermal conductivity of the resin matrix. [ 11,13 ] It can therefore be assumed that the use of graphene fillers increases the through‐thickness thermal conductivity of CF/PPBESK composites through three main mechanisms: (1) Graphene has a higher intrinsic thermal conductivity and can transfer heat more easily; (2) Graphene formation the effective heat conduction network reduces the interface thermal barrier; (3) Graphene acts as a thermal bridge among CFs, and promotes the heat transfer between carbon fibers by forming an effective thermal path between them.…”

Section: Resultsmentioning

confidence: 99%

“…[11] Therefore, it is the key to solve the insufficient thermal conductivity of CF/PPBESK by improving the thermal conductivity of matrix. [12][13][14] One of the improvement measures is synthesizing intrinsically thermal conductive resin, [15,16] such as improving the structure of crystallization, orientation, cross-linking and intermolecular interaction. However, the production process is considerably complicated, cumbersome, high cost and unsuitable for industrialization.…”

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Thermal conductivity and mechanical properties enhancement of CF/PPBESK thermoplastic composites by introducing graphene

Wang

Cheng

et al. 2022

Polymer Composites

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Design and preparation structure/function integrated polymer composites with high thermal conductivities and ideal mechanical properties have attracted widespread attention. Nanoscale graphene were employed to fabricate the thermal-structural integration graphene/carbon fiber/copoly (phthalazinone ether sulfone ketone) composites via solution prepreg followed by hotcompression method. The thermal conductivity (λ) and mechanical properties were all improved with the formation of graphene thermally conductive selfreinforced network. The thermal conductivity was increased to 1.057 W/(m K) by 89.8% higher than the pure carbon fiber composites. Moreover, the flexural strength (1878 MPa), compressive strength (907 MPa) and interlaminar shear strength (66 MPa) of graphene-modified composites improved with 22.1%, 51.9%, and 24.5% than the conventional composites, respectively. Dynamic mechanical analysis has proved that graphene/carbon fiber/copoly (phthalazinone ether sulfone ketone) composites had excellent high temperature mechanical properties, which presented a great potential for structure/ function integrated composites. K E Y W O R D Scarbon fiber composite, structure/function integrated, thermal conductivity | INTRODUCTIONCarbon fiber (CF) reinforced thermoplastic composites (CFRTPs) have become the crucial materials via excellent performance in multiple fields. The optimized combination of high-performance CF and various resin matrix (polyetherimide, polyphenylene sulfide, polyetherketoneketone, etc.) can meet the development requirements of aerospace, military, general aviation, satellite, energy, automobile and electronics industry for advanced materials with lightweight, high strength, high impact resistance and high temperature resistance. [1][2][3][4][5][6] As a new type of high-performance engineering plastic, copoly (phthalazinone ether sulfone ketone)

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Section: Resultsmentioning

confidence: 99%

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confidence: 99%

Thermal conductivity and mechanical properties enhancement of CF/PPBESK thermoplastic composites by introducing graphene

Wang

Cheng

et al. 2022

Polymer Composites

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“…Therefore, enhancing the thermal conductivity of the CF composites cannot rely entirely on increasing the CF length, and too long a CF will cause structural defects inside the composites. Fang et al [ 87 ] reinforced the CF fabric with CF with lengths of 0.1 and 0.5 mm based on the DGEBA resin. From the SEM images, the shorter CFs formed a denser and oriented structure.…”

Section: Influencing Factors Of Thermal Conductivitymentioning

confidence: 99%

Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications

et al. 2021

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With the increasing integration and miniaturization of electronic devices, heat dissipation has become a major challenge. The traditional printed polymer circuit board can no longer meet the heat dissipation demands of microelectronic equipment. If the heat cannot be removed quickly and effectively, the efficiency of the devices will be decreased and their lifetime will be shortened. In addition, the development of the aerospace, automobiles, light emitting diode (LED{ TA \1 “LED; lightemitting diode” \s “LED” \c 1 }) and energy harvesting and conversion has gradually increased the demand for low-density and high thermal conductive materials. In recent years, carbon fiber (CF{ TA \1 “CF; carbon fiber” \c 1 }) has been widely used for the preparation of polymer composites due to its good mechanical property and ultra-high thermal conductivity. CF materials easily form thermal conduction paths through polymer composites to improve the thermal conductivity. This paper describes the research progress, thermal conductivity mechanisms, preparation methods, factors influencing thermal conductivity and provides relevant suggestions for the development of CF composites for thermal management.

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“…Therefore, the radiators are essential for electronic components, and thermal interface materials (TIMs) are also needed between electronic components and heat sinks to improve the heat dissipation efficiency. [1][2][3][4] TIMs usually consist of polymer and inorganic fillers such as metal materials (e.g., silver nanoparticles [5,6] ), ceramic materials (e.g., aluminum oxide [7,8] , zinc oxide, [9,10] titanium oxide, [11] boron nitride, [12][13][14] aluminum nitride, [15,16] and silicon nitride [17] ), and carbon-based materials (e.g., carbonnanotubes, [18,19] graphene, [20,21] and carbon fiber [22] ). Hexagonal boron nitride (hBN) has been considered as a promising candidate used in TIMs owing to its high thermal conductivity and excellent electrical insulation.…”

Section: Introductionmentioning

confidence: 99%

Synergistic enhancement of thermal conductivity in thermal interface materials by fabricating3D‐BN‐ZnOscaffolds

Fang

Chen

Zhang

et al. 2022

Polymer Engineering & Sci

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Three-dimensional boron nitride/zinc oxide (3D-BN-ZnO) scaffolds were prepared by the ice-templating method, in which ZnO particles were in situ formed by sintering. Then, polydimethylsiloxane (PDMS)/3D-BN-ZnO composites were fabricated via vacuum infiltration of PDMS prepolymer into the scaffolds and curing. Compared with the composite prepared by simple blending, the thermal conductivity of the composite prepared based on the ice-templating method is much higher due to the excellent orientation of hexagonal boron nitride (hBN) sheets. Based on the same content of hBN sheets,

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Through-thickness thermal conductivity enhancement of carbon fiber composite laminate by filler network

Cited by 35 publications

References 29 publications

Thermal conductivity and mechanical properties enhancement of CF/PPBESK thermoplastic composites by introducing graphene

Thermal conductivity and mechanical properties enhancement of CF/PPBESK thermoplastic composites by introducing graphene

Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications

Synergistic enhancement of thermal conductivity in thermal interface materials by fabricating3D‐BN‐ZnOscaffolds

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