Synergistic enhancement of thermal conductivity in thermal interface materials by fabricating<scp>3D‐BN‐ZnO</scp>scaffolds

Fang, Hui; Chen, Anlin; Zhang, Lingjie; Chen, Sheng; Wu, Fangjuan; Chen, Hui

doi:10.1002/pen.25952

Cited by 12 publications

(13 citation statements)

References 41 publications

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“…This method proves to be more effective compared to polymer composites with randomly distributed fillers. Numerous methods have been employed to construct three-dimensional filler networks, 24 including chemical vapor deposition, 25 sacrificial template (e.g., NaCl, sucrose), 9,26 ice templating, [27][28][29] 3D printing, 30 and electrospinning. 1,31 While the aforementioned methods can significantly enhance thermal conductivity, most of them are limited by their timeconsuming and complex processing, making large-scale production challenging.…”

Section: Introductionmentioning

confidence: 99%

Construction of alumina framework with a sponge template toward highly thermally conductive epoxy composites

Wu,

Liu,

Yang

et al. 2024

Polymer Engineering & Sci

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Ceramic‐based polymer composites are commonly utilized as thermal management materials due to their high thermal conductivity and electrical insulation properties. One efficient method to enhance the thermal conductivity of these composites is by constructing a three‐dimensional thermal conductive network within the polymer matrix. In this study, alumina was coated onto the surface of polyurethane (PU) foam, followed by high‐temperature removal of the PU foam and sintering of the alumina sheets to obtain a continuous alumina framework. Epoxy resin was then infiltrated into this alumina framework to fabricate highly thermally conductive EP/f‐Al2O3 composites. The EP/f‐Al2O3 composite achieved a thermal conductivity of 2.44 W m−1 K−1 when the filler content of 26.8 vol%, representing a 400% improvement compared to EP/Al2O3 composite with randomly dispersed fillers, and a remarkable 1180% enhancement compared to epoxy resin. Infrared thermal imaging also confirmed the excellent heat dissipation capability of the EP/f‐Al2O3 composites. Overall, this research presents an effective method for producing highly thermally conductive and electrically insulating composites that can be used in electronic thermal management applications.Highlights Fabrication of porous Al2O3 frameworks/epoxy composites. Porous Al2O3 frameworks were fabricated by polyurethane foam template. The obtained EP/f‐Al2O3 composite exhibited excellent thermal conductivity.

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Section: Introductionmentioning

confidence: 99%

Construction of alumina framework with a sponge template toward highly thermally conductive epoxy composites

Wu,

Liu,

Yang

et al. 2024

Polymer Engineering & Sci

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“…31 The second method is to introduce three-dimensional thermally conductive network fillers. [32][33][34][35][36] While this approach can effectively enhance thermal conductivity, the preparation process is complex and costly, necessitating further exploration. The third method involves incorporating hybrid fillers, [37][38][39][40] which involves mixing fillers of different types, shapes, and sizes into the polymer matrix.…”

Section: Introductionmentioning

confidence: 99%

Polyphenylene oxide/boron nitride–alumina hybrid composites with high thermal conductivity, low thermal expansion and ultralow dielectric loss

Xu,

Wang

et al. 2024

Polymer Composites

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Traditional integrated circuit (IC) packaging materials and printed circuit board substrate materials suffer from several limitations including low thermal conductivity, high coefficient of thermal expansion (CTE), and poor dielectric properties. Although significant efforts have been made to enhance these properties, achieving a single composite system with simultaneous high thermal conductivity, extremely low CTE, and dielectric loss remains a formidable task. In this study, we propose a hybrid polymer composite system that addresses these challenges. Our approach involves utilizing a thermosetting polyphenylene oxide (PPO) as the resin matrix, while incorporating boron nitride (BN) sheets with high thermal conductivity and alumina (Al2O3) spheres with favorable fluidity as fillers. To optimize the composite properties, the filler surfaces are modified using dopamine and silane coupling agents, ensuring proper interface control. The composites exhibit significant improvements in thermal conductivity, reduced dielectric loss and CTE, while maintaining excellent processibility. Specifically, with a composition of 25 vol% BN and 25 vol% Al2O3, the thermal conductivity of the composite reaches 2.18 W·m−1 K−1, surpassing neat PPO resin by a factor of 10.9. Simultaneously, the CTE decreases from 2.27% to 1.18% between 50 and 260°C, and the dielectric loss reduces from 0.0024 to 0.0011 at 10 GHz, as compared to neat PPO resin.Highlights The reported novel hybrid composite offers a promising solution to the limitations of traditional IC packaging materials. The reported hybrid composite exhibits significantly improved thermal conductivity, ultralow dielectric loss, and reduced coefficient of thermal expansion, while maintaining excellent processibility. The thermal conductivity of the composites reaches 2.18 W·m−1 K−1, surpassing that of the neat resin by a factor of 10.9, meanwhile the dielectric loss is as low as 0.0011 at 10 GHz, which is extremely difficult to achieve simultaneously for thermosetting polymer composites. Synergetic effects were realized with the hybridization of fillers with different dimensionality, and proper filler surface modification.

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“…Nowadays, matrix resins are usually reinforced by the use of thermal conductive filler 7,8 (e.g., metallic fillers, 9,10 carbon-based materials, [11][12][13][14][15] and ceramic fillers [16][17][18][19][20][21][22] ) to enhance the TC values. Among these, ceramic fillers (Al 2 O 3 , SiO 2 , AlN, Si 3 N 4 , MgO, and BN) have been widely investigated for their potential in thermal conductive and electrical insulation in composites due to their inherent properties.…”

Section: Introductionmentioning

confidence: 99%

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

He,

Zhang,

Liu

et al. 2023

Polymer Composites

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Thermal conductive polymer‐based composites synchronously with stable dielectric and excellent mechanical properties are urgently needed for high‐temperature‐resistant electronic devices. Here, a significant improvement in the thermal conductivity (TC), thermal stability, dielectric, and mechanical performance was simultaneously achieved in the polyarylene ether nitrile (PEN)/divinyl siloxane‐bisbenzocyclobutene (BCB) matrix through the incorporation of boron nitride nanosheets (BNNS) combined together with the post‐solid phase chemical reaction technique. The significant increase in the effective filler‐filler and filler‐crystal contacts in the composites was the main reason for the improvement in TC and dielectric constant. Besides, glass transition temperature (Tg) and mechanicals were enhanced in the presence of cross‐linked networks. By synchronously adding 15 vol% BNNS, the TC of composites after treatment reached up to 5.582 W/m.K, enhanced by 4.4 times higher than untreated. The dielectric constant was down to 2.93 at 1 MHz and the loss remained at a relatively low level. Meanwhile, the composite showed significantly enhanced thermal stability, mechanicals, and hydrophobicity (Tg = 336°C, T5% = 529°C, tensile strength and modulus was 94.5 MPa and 5.3 GPa, respectively, the contact angle was 101.76°). Thus, it promotes an effective strategy for fabricating a high‐performance‐polymer composite, which has the potential used in electronic materials.Highlights Crystallization‐crosslinking strategy optimizes overall performance. Crystals fill gaps between BNNS layers and connect thermal conductive pathway. Crosslinked networks limit molecular chain motion to reduce phonon scattering. The highest TC of the PEN/BCB/BNNS composite is up to 7.451 W/m.K. Thermal property shows significant improvement after crosslinking especially Tg.

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Synergistic enhancement of thermal conductivity in thermal interface materials by fabricating3D‐BN‐ZnOscaffolds

Cited by 12 publications

References 41 publications

Construction of alumina framework with a sponge template toward highly thermally conductive epoxy composites

Construction of alumina framework with a sponge template toward highly thermally conductive epoxy composites

Polyphenylene oxide/boron nitride–alumina hybrid composites with high thermal conductivity, low thermal expansion and ultralow dielectric loss

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

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