1978 IEEE International Solid-State Circuits Conference. Digest of Technical Papers 1978
DOI: 10.1109/isscc.1978.1155771
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Three-phase, backside illuminated 500×500 CCD imager

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Cited by 4 publications
(2 citation statements)
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“…In this context, it always has to be kept in mind that the individual pixels are not sensitive to light over their whole area but also contain insensitive regions resulting from the circuitry within each pixel. Nevertheless, by using techniques like backside illumination [11], [12] and / or microlenses [13]- [17] a fill-factor of nearly 100% can be achieved. Using this, one gets an array of rectangular light sensitive areas and the acquisition process can be regarded as an integration of the incident light on identical areas located on the twodimensional regular grid.…”
Section: Proposed Sensor Layoutmentioning
confidence: 99%
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“…In this context, it always has to be kept in mind that the individual pixels are not sensitive to light over their whole area but also contain insensitive regions resulting from the circuitry within each pixel. Nevertheless, by using techniques like backside illumination [11], [12] and / or microlenses [13]- [17] a fill-factor of nearly 100% can be achieved. Using this, one gets an array of rectangular light sensitive areas and the acquisition process can be regarded as an integration of the incident light on identical areas located on the twodimensional regular grid.…”
Section: Proposed Sensor Layoutmentioning
confidence: 99%
“…Looking at state-of-the-art image sensors, it becomes obvious that one always tries to make most of the area sensitive to light and the objective hence is to bring the fill-factor close to one. This can be achieved for example by applying techniques like backside illumination [11], [12] or the use of microlenses [13]- [17]. However, these techniques again lead to a regular sensing and therewith the resolution is limited by aliasing.…”
Section: Introductionmentioning
confidence: 99%