2009 59th Electronic Components and Technology Conference 2009
DOI: 10.1109/ectc.2009.5074117
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Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology

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“…Historically, implant casings have been metallic ( Chong et al, 2020 ). Borosilicate glass encapsulation is an attractive alternative to metallic enclosures due to its excellent material properties, biocompatibility and recent advancements in micro-machining ( Mund and Leib, 2004 ; Ginggen et al, 2008 ; Hansen et al, 2009 ; Leib et al, 2009 ).…”
Section: Introductionmentioning
confidence: 99%
“…Historically, implant casings have been metallic ( Chong et al, 2020 ). Borosilicate glass encapsulation is an attractive alternative to metallic enclosures due to its excellent material properties, biocompatibility and recent advancements in micro-machining ( Mund and Leib, 2004 ; Ginggen et al, 2008 ; Hansen et al, 2009 ; Leib et al, 2009 ).…”
Section: Introductionmentioning
confidence: 99%