This paper presents a rule-based software tool developed to assist with the definition and verification of processing sequences. Insight is given on the requirements needed to phrase the rules and how they can be classified. It is shown, how generics play an important role in order to increase the flexibility of the defined rules. The strategy which controls the execution of the rules is explained and the limitations of the concept are pointed out.The usage and usefulness of the presented software is illustrated by an example showing the fabrication of a micro coil.
The use of borosilicate glass for anodic wafer bonding to silicon is well established in industry. In this paper we present a matured approach, where a microstructured borosilicate glass thin-film instead of a bulk glass wafer is used as anodic bond layer. A glass layer with a thickness of 3-5 m is sufficient for a stable bond at very moderate bond parameters with bond voltages in the range of 30-60 V at standard bond temperatures of around 300°C and below. This enables the use of anodic bonding also for sensitive devices
The novel wafer-level packaging (WLP) process invented allows hermetic capping of optical devices on wafer-level yielding miniaturized glass cavity windows on top of the optical area, at the same time leaving the contact area accessible for standard electrical connections i.e. wire bond. These optical cavity packages are used within standard chip-on-board (COB) assemblies for high performance optical applications providing high yields and utmost reliability for miniaturized optical devices at low costs
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