2004
DOI: 10.1017/cbo9780511754715
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Thin Film Materials

Abstract: Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underp… Show more

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Cited by 837 publications
(604 citation statements)
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“…This agrees very well with the literature value of 1.91 ppm/°C for pure Ag. 6 It is reasonable that the CTE remains the same and is not affected by the pores.…”
Section: ͑6͒mentioning
confidence: 96%
“…This agrees very well with the literature value of 1.91 ppm/°C for pure Ag. 6 It is reasonable that the CTE remains the same and is not affected by the pores.…”
Section: ͑6͒mentioning
confidence: 96%
“…4,13 We will see that these processes can have catastrophic consequences because it can lead to film failure by bending. The conditions leading to buckling, delamination, and failure of the film produced by layer transfer and subjected to a compressive stress m are investigated in detail in Secs.…”
Section: Buckling Delamination and Failure Of The Filmmentioning
confidence: 99%
“…In addition, in first approximation, the fracture energy G c of the film/substrate interface is assumed to be constant and independent of the phase angle = arctan͑ K II K I ͒ of the stress acting on the interface. 4 …”
Section: Buckling Delamination and Failure Of The Filmmentioning
confidence: 99%
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