Mechanical characterization of solution-derived nanoparticle silver ink thin films

Greer, Julia R.; Street, R. A.

doi:10.1063/1.2735404

Cited by 59 publications

(50 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Consequently the thickness at the trace edge is higher than the trace centre. From the literature, crack formations have been reported to occur for thicker films [40] and films which are above a certain critical thickness [41,42]. When the silver overprint was increased to 2 layers, a wider crack area was observed for the smaller traces (100 µm and 500 µm), while the cracks for the 1 mm trace remained at the edges (Figure 3(B)).…”

Section: Cracking In Silver Traces On Emd 6200mentioning

confidence: 96%

“…The silver traces on the EMD 6200 would experience compressive residual thermal stresses due to the higher CTE of the insulator (60-80 µm °C -1 ) [22] compared to the silver trace (α Ag = 19.6 µm °C -1 ) [10,40]. Furthermore an inhomogeneous stress distribution could have resulted during the solidification of the silver trace, where compression is generated in the bottom-most region (due to the CTE mismatch), while the top-most region could have remained in tension.…”

Section: Cracking In Silver Traces On Emd 6200mentioning

confidence: 99%

See 1 more Smart Citation

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Lim

Goh

Liu

et al. 2015

Surface and Coatings Technology

View full text Add to dashboard Cite

Citation: LIM, Y.Y. ... et al, 2015. Surface modification of an ambient UVcured dielectric to realise electrically conducting traces. Surface and Coatings Technology, 266, Additional Information:• This article was accepted for publication in the journal, Surface and Coat- AbstractThere has been much interest in the printing of silver inks onto flexible substrates, for which intermediate dielectric layers are often required to achieve suitable wettability. This work seeks to realize continuous silver traces overprinted onto UV-curable dielectrics through surface modification techniques (thermal and UV-ozone post treatments), when the UV light source used for the curing is non-optimal. Two UV curable dielectric materials were deposited and the effects of curing time and curing atmosphere on the inkjet printability of a commercially available silver ink were investigated. Good wettability of the silver ink was obtained following ozone treatment of the dielectric layers, where the treatment required was found to be a function of the dielectric formulation and the curing atmosphere. Water droplet contact angle measurements were used to analyse the resulting changes in the surface conditions of the dielectric layers. The results provided an indication, but were not sufficient for predicting whether silver traces with measurable resistance could be subsequently obtained. Instead, measurable silver trace resistances were found to be influenced by the occurrence of cracks in the trace and possibly the degree of cross-linking present in the dielectric. Following these results, the authors demonstrate that electrically conductive traces can be achieved on ambient cured samples, which yields a more flexible solution compared to inert cured samples.

show abstract

Section: Cracking In Silver Traces On Emd 6200mentioning

confidence: 96%

Section: Cracking In Silver Traces On Emd 6200mentioning

confidence: 99%

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Lim

Goh

Liu

et al. 2015

Surface and Coatings Technology

View full text Add to dashboard Cite

show abstract

“…Nanoporous films usually exhibit different mechanical properties compared to the bulk, especially when the elastic modulus and hardness are considered [18]. Basically, those two parameters have low values that are greatly affected by the porosity as well as by the grain size.…”

Section: Interconnects Reinforcement By Electroless Nickel Platingmentioning

confidence: 99%

Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

Cauchois

Saadaoui

Legeleux

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

View full text Add to dashboard Cite

The nanoporous nature of the inkjet printed silver nanoparticles entail low hardness and surface effective contact area for being compatible with pads that are suitable for wire-bonding in electronic packaging. Electroless nickel plating is a selective metal deposition technique which can brings the required thickness and hardness for further pads processing. Here, a 1.7 µm thick nickel layer is deposited on top of 600 nm thick printed and sintered silver nanoparticles using Kapton polyimide as substrate. Prior to plating, a special attention was put on tuning microstructures of printed silver pads by sintering nanoparticles at various temperature ramps (0.1, 10 and 50°C/s) up to 200°C. Results show that fast sintering exhibits the lowest electrical resistivity which is suitable in printed interconnects. However, wire-bonding on nickel pads is best achieved when low sintering ramp is used. This slow sintering presents the highest adhesion strength at the nickel/silver interface since the pores dimensions were restricted to the nanoscale. The validation of the optimized bonding process came from the low electrical contact resistance between plated nickel and the bonded gold wire, and from the wire-pull test which is in accordance with the MIL-STD 883 standard. The actual results show that a compromise has to be found when emphasis is on patterning low resistive interconnects or stiff pads for wire-bonding applications. This compromise is tailored by the sintering engineering.

show abstract

“…Mechanical properties of printed structures have been main interests in various engineering applications [123].…”

Section: Insulating Blockmentioning

confidence: 99%

Hybrid 3D printing by bridging micro/nano processes

Yoon

Jang

Kim

et al. 2017

J. Micromech. Microeng.

View full text Add to dashboard Cite

The aim of this work was to develop a novel hybrid manufacturing method for nanoscale three-dimensional (3D) printing with multi-material capabilities. 3D structuring methods at the micro/nanoscale are major goals of various engineering fields, and much work has been carried out to improve the minimum feature size, geometrical complexity, and material selection. With the aim of nanoscale multimaterial printing, a hybrid process was reported with an integrated nanoparticle deposition system (NPDS) and focused ion beam (FIB) system; however this process has limitations in terms of surface roughness and control over the layer thickness, as well as with the process scale, and furthermore, lack of sacrificial layers.In this dissertation, a novel hybrid process is described, which combines aerodynamically focused nanoparticle (AFN) printing, micro-machining and focused ion beam (FIB) milling. AFN printing is based on NPDS, and micromachining was used for local planarization. In addition to these processes, spincoating was used to fabricate sacrificial layers. By bridging these different II micro/nanoscale processes, the resulting hybrid process can address the limitations of the individual processes.To create the hybrid process, each process was investigated to enable compatibility. With the AFN printing system, the surface morphology of a detached substrate was observed, and the bonding mechanism between the substrate and nanoparticles was investigated. A novel printing strategy was identified to reduce the scale of the process. With the micro-machining system, different tool geometries were investigated. Complex geometries inspired by conventional-scale tools were implemented on the micro-scale, and their effects were investigated. With the FIB system, material re-deposition phenomena were investigated to reduce defects that occur during ion sputtering. A novel path-generation strategy was identified and investigated for different scanning paths.Process capability is discussed using fabrication examples and functional applications. The novel hybrid process represents a significant advance in the state of the art, and enables far improved process scales or dimensional degree of freedom, without losing the advantages of broad choice of materials.3D-pinted micro bi-material cantilevers were fabricated as a thermal actuator.The mechanical and thermal properties of the structure were investigated using an in-situ measurement system, and irregular thermal phenomena were analyzed. It is expected that these in-situ measurements of the 3D printed microstructure will contribute to materials research.Various 3D structures can be fabricated using the process described here from a range of metal/ceramic inorganic materials, including polymers. In particular, it is expected that the process will contribute to the area of customized nanoscale structuring, with potential applications in medical treatments. It is also expected that this work will contribute to further improvements in manufacturing technology by combining different m...

show abstract

Mechanical characterization of solution-derived nanoparticle silver ink thin films

Cited by 59 publications

References 17 publications

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

Hybrid 3D printing by bridging micro/nano processes

Contact Info

Product

Resources

About