1992
DOI: 10.1063/1.1143749
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Thickness and conductivity of metallic layers from eddy current measurements

Abstract: A robust method that uses eddy current measurements to determine the conductivity and thickness of uniform conductive layers is described. The method was tested by estimating the conductivity and thickness of aluminum and copper layers on various substrate metals, and the thickness and conductivity of free-standing foils of aluminum. The electrical impedance was measured for air-core and ferrite-core coils in the presence and absence of the layer for frequencies ranging from 1 kHz to 1 MHz. The thickness and c… Show more

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Cited by 188 publications
(89 citation statements)
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“…The results of blindly using the nearest available instrument have often been disappointing. Recent work has begun to offer a theoretical underpinning to experimental measurements [3][4], and our work continues this line of inquiry. Modeling must be performed before equipment is purchased, or expensive experiments undertaken.…”
Section: Conductivity Profile Measurementsmentioning
confidence: 96%
“…The results of blindly using the nearest available instrument have often been disappointing. Recent work has begun to offer a theoretical underpinning to experimental measurements [3][4], and our work continues this line of inquiry. Modeling must be performed before equipment is purchased, or expensive experiments undertaken.…”
Section: Conductivity Profile Measurementsmentioning
confidence: 96%
“…In order to carry out NDT characterization of CFRP structures and optimize their manufacturing, different inspection techniques have been studied and developed such as ultrasonic tests, scanning acoustic microscopy, embedded optical fibre, microwave technique scanning and DC or AC conductivity measurements. ECT has gained interest for in-service inspection and rapid quality control thanks to its simplicity, and specimen -probe non-contacting [15].…”
Section: Introduction About Composite Materialsmentioning
confidence: 99%
“…Other recent work can be found in the technical reports of C.V. Dodd [5] and in references [6] and [7]. A more complete description of the work presented here can be found in [8].…”
Section: Introductionmentioning
confidence: 99%