Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

Zhang, Buen; Jabarullah, Noor H.; Alkaim, Ayad F.; Danshina, Svetlana; Krasnopevtseva, I. V.; Yuan, Zheng; Geetha, Nisith

doi:10.1108/ssmt-06-2020-0028

Cited by 11 publications

(7 citation statements)

References 26 publications

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“…( 4) is a power equation that was employed to illustrate the relationship www.nature.com/scientificreports/ between the inelastic work and the fatigue life, or the characteristic life. Where Z ( the fatigue exponent) and R (the ductility coefficient) are the equation constants, and W is the average inelastic work per cycle 26,27 . In addition, the plastic stain was employed to model the fatigue life using a power equation provided in Eq.…”

Section: Methodsmentioning

confidence: 99%

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Hani

Athamneh

Abueed

et al. 2023

Sci Rep

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Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation between solder joints reliability and the most frequent failure modes seen in electronic devices. Due to their superior mechanical and fatigue properties, SAC alloys have supplanted Pb-solder alloys as one of the most commonly used solder materials used as interconnection joints on electronic packages. The main aim of this study is to develop a prediction model of the fatigue life of the solder joints as a function of the experimental conditions. Using a customized experimental setup, an accelerated fatigue shear test is applied to examine the fatigue life of the individual SAC305 solder joints at actual setting conditions. OSP surface finish and solder mask defined are used in the studied test vehicle. The fatigue test includes three levels of stress amplitude and four levels of testing temperature. A two-parameter Weibull distribution is used for the reliability analysis for the fatigue life of the solder joints. A stress–strain curve is plotted for each cycle to construct the hysteresis loop at each cyclic load and testing temperature. The acquired hysteresis loop is used to estimate the inelastic work per cycle and plastic strain. The Morrow energy and Coffin Manson models are employed to describe the effects of the fatigue properties on the fatigue life of the solder joints. The Arrhenius model is implemented to illustrate the evolutions in the stress life, Morrow, and Coffin Manson equations at various testing temperatures. The fatigue life of SAC305 solder joints is then predicted using a general reliability model as a function of the stress amplitude and testing temperature.

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Section: Methodsmentioning

confidence: 99%

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Hani

Athamneh

Abueed

et al. 2023

Sci Rep

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“…Accordingly, the second resistance threshold was obtained as 104Grms vibration load. In both sets of experiments, the vulnerable part was the solder joints of devices to the PCB as reported in several previous studies (Sung and Robert, 2019;Zhang et al, 2020;Akbari et al, 2016). Different physical properties of the PCB, solder joints and the lead of the components were reported as the root cause of this kind of failure.…”

Section: Case Study and Experimental Proceduresmentioning

confidence: 72%

Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads

Supriyono

Chen²,

Yapanto³

et al. 2021

SSMT

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Purpose In this paper, a lifetime estimation model for the solder joint is proposed which is capable of considering both severe and running mechanical shocks which is the real case in electric converters in the automotive and aerospace applications. This paper aims to asses the reliability of the solder joint under mixed exposure of mechanical loads. Design/methodology/approach Mechanical failure process may put at risk the perfect performance of any kinds of electronic systems regardless of the applications they are prepared for. Observation of solder joint health in an electronic assembly under simultaneous exposure of severe and running shocks is an open problem. Three commonly used soldering compositions are considered while the electronic assembly is exposed to three well-known driving cycles. Findings The results show that the best performance is achieved using SAC405 soldering alloy in comparison with Sn63Pb37 and SAC387 solder alloy. Consideration of mixed exposure to the mechanical loads leads to much more accurate lifetime estimation of the solder joint in the electronic assemblies. Originality/value The originality of the paper is confirmed.

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“…Coffin-Manson type model with the equivalent creep strain as the damage controlling mechanism [11,12] , and the second is an energy-based Morrow type model with the dissipated creep energy as the damage controlling mechanism [13][14][15] .…”

Section: Device Structure and Model Definitionmentioning

confidence: 99%

Low temperature thermal strain of the IRFPA and the creep lifetime evaluation of solder joints

Liu

Yan

Liao

et al. 2023

AOPC 2022: Optoelectronics and Nanophotonics

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Cryogenic Infrared Rays Focal Plane Array (IRFPA) detectors have been widely used in industry, transportation, security monitoring, meteorology and medicine because of the high sensitivity and temperature resolution. For HgCdTe IRFPA detectors, the typical working temperature is about 80 K. To make the IRFPA detector works at low temperatures, the detector should be integrated on a Dewar cold platform, whose refrigeration power would be higher than the heat load of the IRFPA. In general, the IRFPA detector and the Dewar cold platform would be integrated together to form a Dewar assembly at room temperature. In addition, the materials in IRFPA have different thermal expand coefficients, it means the thermal mismatch in the IRFPA would be an unavoidable issue in work. The thermal strain has a significant effect on the solder joints in switching cycle, which could lead to the creep strain and thermal fatigue crack. With the increase of the switch cyclic number, the creep strain and thermal fatigue crack under the thermal stress would lead to the failure of solder joints. Therefore, the low temperature thermal strain in switching cycle can affect the reliability of IRFPA detectors. So, the low temperature thermal strain and the creep lifetime of solder joints has been researched.

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Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

Cited by 11 publications

References 26 publications

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads

Low temperature thermal strain of the IRFPA and the creep lifetime evaluation of solder joints

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