Thermoelectric Property Requirements for On-Chip Cooling of Device Transients

Nimmagadda, Lakshmi Amulya; Sinha, Sanjiv

doi:10.1109/ted.2020.3009085

Cited by 18 publications

(9 citation statements)

References 24 publications

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“…This leads to temporal changes in the intensities of the hotspots, where the time scale is too short for system-level cooling to be effective during the dissipation time scales. Nimmagadda et al [245] theoretically explored on-chip TEC over short (≈100 ms) durations as a potential solution for managing transitions near the junction. Net cooling occurs when the rise in the peak transient temperature is reduced in the presence of an operating TEC in comparison with that in its absence.…”

Section: Conclusion and Prospectsmentioning

confidence: 99%

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Wearable Thermoelectric Materials and Devices for Self‐Powered Electronic Systems

et al. 2021

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Because of their readiness and high power bandwidth, batteries are the preeminent source of power supply for portable electronics, but are subject to periodic recharging and replacement. Hence, a key challenge is to design suitable and sustainable power sources for portable electronic devices. Harvesting energy from the human body is suitable for providing consistent and uninterrupted energy for wearable electronic devices. The daily activities of a 68-kg adult can generate over 100 W of power, through breathing, heating, blood transport, and walking. [3] Thus, converting 1% of the power generated by the human body may be enough to support the work of most portable electronics. Various energy-harvesting technologies, such as, triboelectric nanogenerators (TENGs), [4][5][6] piezoelectric nanogenerators, [7] and thermoelectric generators (TEGs), [8] have been developed to convert human energy (from human motion and body heat) into electricity. In line with recent developments in wearable electronics and e-skins, the use of a self-powered direct-current (DC) electric power supplier is inevitable for activating human body-adjustable electronic systems. [9] Among the various energy-autonomous devices, [10] only TEGs can permanently produce DC electric power without complex power managing components, and they are maintenance free. Moreover, solar energy and vibration-based energy harvesters areThe emergence of artificial intelligence and the Internet of Things has led to a growing demand for wearable and maintenance-free power sources. The continual push toward lower operating voltages and power consumption in modern integrated circuits has made the development of devices powered by body heat finally feasible. In this context, thermoelectric (TE) materials have emerged as promising candidates for the effective conversion of body heat into electricity to power wearable devices without being limited by environmental conditions. Driven by rapid advances in processing technology and the performance of TE materials over the past two decades, wearable thermoelectric generators (WTEGs) have gradually become more flexible and stretchable so that they can be used on complex and dynamic surfaces. In this review, the functional materials, processing techniques, and strategies for the device design of different types of WTEGs are comprehensively covered. Wearable self-powered systems based on WTEGs are summarized, including multi-function TE modules, hybrid energy harvesting, and all-in-one energy devices. Challenges in organic TE materials, interfacial engineering, and assessments of device performance are discussed, and suggestions for future developments in the area are provided. This review will promote the rapid implementation of wearable TE materials and devices in self-powered electronic systems.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adma.202102990.

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Section: Conclusion and Prospectsmentioning

confidence: 99%

“…Nimmagadda et al. [ 245 ] theoretically explored on‐chip TEC over short (≈100 ms) durations as a potential solution for managing transitions near the junction. Net cooling occurs when the rise in the peak transient temperature is reduced in the presence of an operating TEC in comparison with that in its absence.…”

Section: Conclusion and Prospectsmentioning

confidence: 99%

Wearable Thermoelectric Materials and Devices for Self‐Powered Electronic Systems

et al. 2021

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“…This effect is called the Seebeck effect [134]. A suitable material combination for TEC has a high Seebeck coefficient, a high electrical conductivity, and a high thermal conductivity [135]. An example of such a material is bismuth telluride.…”

Section: Peltier Elementsmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technologies for the over-current performance of SiC power modules in power electronics converters. It presents the limitations produced at the power module level by packaging materials which include semiconductor chips, substrates, metallization, bonding techniques, die attach, and encapsulation materials. Specifically, technologies for over-current related temperatures in excess of 200 • C are discussed. The paper also discusses potential technologies which have been proven or may be potential candidates for improving the safe operating area. The discussed technologies are use of phase change materials below the semiconductor chip, Peltier elements, new layouts of the power modules, control and modulation techniques for converters. Special attention has been given to an overview of various potential phase change materials which can be considered for high-temperature operations.

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“…A recent computational study evaluated the effectiveness of an embedded unipolar TEC for transient active cooling of a hotspot, as shown in Fig. 4(a) [57]. As established in Section IV, active cooling requires thermoelectric materials with high S 2 σ and high k. This study showed that conventional TEC materials such as Bi 2 Te 3 alloys do not provide any cooling advantage due to their intrinsically low thermal conductivities (k ≈ 1.5 W/mK) compared to that of the native Si substrate (k ≈ 130 W/mK).…”

Section: Transient Operationmentioning

confidence: 99%

“…Enhancement of the PF is more consequential for cooling applications. In a recent work, we explored the concept of active cooling in managing thermal transients, where the cooling depends on the PF and not Z [57]. The 2-D electron gas (2-DEG) in heterostructures and in atomic layer materials also appears to be promising in this regard.…”

Section: Future Prospects For Te Coolingmentioning

confidence: 99%

Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review

Nimmagadda

Mahmud

Sinha

2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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The thermoelectric effect forms the basis of Peltier cooling that has attracted interest for solid-state refrigeration for more than a century. The dearth of materials level efficiency in converting between heat and electricity has limited widespread applications. With renewed focus on energy technologies in the past three decades, the thermoelectric effect has been intensely explored in new materials using state-of-the-art advances in materials fabrication, characterization techniques, and theory. This article aims to navigate the complex landscape of these studies to identify credible advances, pinpoint continuing problems, and lay out future prospects for both research and applications, with emphasis on electronics cooling.

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Thermoelectric Property Requirements for On-Chip Cooling of Device Transients

Cited by 18 publications

References 24 publications

Wearable Thermoelectric Materials and Devices for Self‐Powered Electronic Systems

Wearable Thermoelectric Materials and Devices for Self‐Powered Electronic Systems

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review

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