2017
DOI: 10.1039/c7tc01937h
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Thermoelectric performance enhancement of Cu2S by Se doping leading to a simultaneous power factor increase and thermal conductivity reduction

Abstract: A series of single-phased Cu2S1−xSex bulks were prepared by using mechanical alloying (MA) combined with spark plasma sintering (SPS). Our results suggest that the TE properties of Cu2S can be greatly enhanced by simultaneously increasing PF and decreasing κ via doping a sole Se element.

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Cited by 80 publications
(59 citation statements)
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“…The marked diffraction peaks can be indexed to the (101), (102), (103), (110), (108), and (116) diffraction planes, respectively. However, there is a progressive shift to lower 2θ angle at higher Se contents (Figure S1, Supporting Information), indicative of enlarged lattice spacing of CuS 1− x Se x nanosheet caused by heavy Se atoms (1.98 Å) substitution for S atoms (1.84 Å) . As shown in Figure b, the peak appearing at about 475 cm −1 in the spectrum of CuS nanosheet match well with the reported Raman spectrum of CuS crystal, which can be attributed to the stretching mode of the S‐S bond .…”
supporting
confidence: 81%
“…The marked diffraction peaks can be indexed to the (101), (102), (103), (110), (108), and (116) diffraction planes, respectively. However, there is a progressive shift to lower 2θ angle at higher Se contents (Figure S1, Supporting Information), indicative of enlarged lattice spacing of CuS 1− x Se x nanosheet caused by heavy Se atoms (1.98 Å) substitution for S atoms (1.84 Å) . As shown in Figure b, the peak appearing at about 475 cm −1 in the spectrum of CuS nanosheet match well with the reported Raman spectrum of CuS crystal, which can be attributed to the stretching mode of the S‐S bond .…”
supporting
confidence: 81%
“…Currently, Tak et al found that introducing additional Cu into Cu 2 Se can reduce the room‐temperature m * of β‐Cu 2 Se. Meanwhile, introducing additional SiC, Ag‐doping in Cu 2 Se and Se‐doping in Cu 2 S can increase room‐temperature m *.…”
Section: Strategies For the Thermoelectric Property Enhancementmentioning
confidence: 99%
“…16 Many fabrication techniques have been studied since Cu 2 S was discovered to be a highly efficient thermoelectric material, including melt-solidication, 17 mechanochemical synthesis, 18 ultrasonication and pressing, 19 chemical synthesis and hot pressing, 20 hydrothermal synthesis and hot pressing, 21 hydrothermal synthesis and mechanical alloying followed by spark plasma sintering, 22 mechanical alloying followed by spark plasma sintering, 23 and mechanical alloying with Se doping followed by spark plasma sintering. 24 These techniques however, require high pressure, high temperature and lengthy fabrication times which all contribute to the embodied energy of the material. In contrast, printing can be achieved at ambient temperature and pressure and with fast fabrication times.…”
Section: Introductionmentioning
confidence: 99%