Thermodynamics and phase diagrams of lead-free solder materials

Ipser, Herbert; Flandorfer, Hans; Luef, Ch.; Schmetterer, Clemens; Saeed, Usman

doi:10.1007/978-0-387-48433-4_1

Cited by 6 publications

(4 citation statements)

References 37 publications

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“…A multitude of investigations has been performed to study different physico-chemical properties of lead-free Sn-Ag-Cu (SAC) solder alloys and to analyze their structure in the solid and liquid state [1][2][3][4][5][6][7]. However, due to their higher melting temperatures compared to Pb-Sn solders and the formation of brittle intermetallic compound layers, a number of recent studies addressed the possibility to improve the characteristics of SAC solders by adding of fourth element in the bulk or nano-sized form, such as Co, Ni, Fe or Al [8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Yakymovych

Mudry

Shtablavyi

et al. 2016

Materials Chemistry and Physics

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Section: Introductionmentioning

confidence: 99%

Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Yakymovych

Mudry

Shtablavyi

et al. 2016

Materials Chemistry and Physics

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“…Such small heat entropy indicates that it is very difficult to detect the transformation on cooling. The authors in references [20,21] also report the formation enthalpy of some Cu-Sn binary intermetallic phases. For 200 h milling time, it is inferred that the largest exothermic and endothermic peaks seen in 75 It is reported that the peak broadening and the reduction in intensity of the diffraction peaks of ballmilled powders are associated with the refinement in crystallite size, lattice internal strain, and the instrumental effects [22,23].…”

Section: Resultsmentioning

confidence: 99%

Structural Evolution Properties of Cu-25 wt %Sn Alloy During Ball Milling

Arslan

2014

J. Adv. Therm. Sci. Res.

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In the present study, Cu-25 wt %Sn alloy samples were prepared by the mechanical alloying process using planetary high-energy ball mill. The alloy formation and different physical properties associated with their formations were investigated as a function of milling times of 0, 10, 20, 70, 80, 100, 120, 150 and 200 h by means of the x-ray diffraction (XRD) technique, scanning electron microscopy (SEM) and differential scanning calorimeter (DSC). After milling time of 80 h, the complete formation of martensite transformation is observed. When milling time increases from 70 to 120 h, the grain size decreases from 20.8 to 8.6 nm, while the strain increases from 4.73 % to 7.59 %. It is inferred that the martensite volume fraction increases from 30 to 55 % when milling time increases from 20 to 200 h. Moreover, by using SEM the grain morphologies at different formation stages during ball milling are observed.

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“…The contact materials are usually made up from layers of nickel or palladium (Ipser, Flandorfer, Luef, Schmetterer & Saeed, 2006). The addition of third or fourth elements in solder alloys can usually improve the properties of the solders; which are mainly the mechanical, physical and thermal properties (Mohd Salleh, Sandu, Abdullah, Sandu & Saleh, 2017).…”

Section: Gallium As a Microalloying Elementmentioning

confidence: 99%

“…Consequently, the solder joint will fail to achieve the desired functionality, causing failure of the entire electronic part assembly (Ipser, Flandorfer, Luef, Schmetterer & Saeed, 2006).…”

Section: Intermetallic Formationmentioning

confidence: 99%

Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

Mazlan¹

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Use of leaded solder was an issue in human health a few years back, while lead-free solders developed recently possesses higher melting temperature than conventional leaded solders. Thus, further research to develop more Sn-based solders with low-eutectic temperatures as compared to existing alloys are required. In this study, the effects of Gallium addition to five Sn-based alloys (Sn, SAC, Sn100C, Sn100CV, Sn-0.7Cu) at three different concentrations (0wt%Ga, 0.1wt%Ga and 2.0wt%Ga) was investigated. The microstructures of these alloys and the nature of their interactions with substrates including Electroless Nickel Immersion Gold (ENIG) and Organic Solderability Preservative (OSP) finishes is discussed.Thermal Analysis was done to investigate the resulting nucleation temperature of each alloy. The Sn-based alloys with 2.0wt% Ga additions had a reduction of 2℃-7℃ in growth temperatures when compared to their solidus temperatures. This matches the prediction from Sn-Ga phase diagram from previous studies. The intermetallic layers that formed between the solder and substrate showed that 0.1wt% Gallium resulted in a reaction with both Copper OSP and Nickel ENIG substrates, but higher concentrations of Ga (2.0wt%) did not result in a reaction at the interface. The microstructure analysis also showed that cracks formed in the cast specimens containing Ga and the solder balls appeared to have poorer wettability with increased Ga content. Both results suggested that there is segregation of Ga due to its low melting point, inducing low melting phase during solidification.In conclusion, the results indicate there is a critical composition of Ga which produces a homogeneous reaction with the alloys to assist in the fabrication of solder balls. Further studies on the properties of Ga containing alloys are required to fully understand the commercial potential.

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Thermodynamics and phase diagrams of lead-free solder materials

Cited by 6 publications

References 37 publications

Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Structural Evolution Properties of Cu-25 wt %Sn Alloy During Ball Milling

Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

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