Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Yakymovych, A.; Mudry, S.; Shtablavyi, I.; Ipser, Herbert

doi:10.1016/j.matchemphys.2016.06.083

Cited by 17 publications

(9 citation statements)

References 27 publications

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“…According to Ref. [26], the melting temperature of nanocomposite (SAC305) 100−x (nanoCo) x alloys up to 0.8 wt% nano Co is about 490 ± 1 K, which is in agreement with our assumption. Therefore, starting from the first cooling the electrical resistivity of quaternary (SAC387) 100−x Co x alloys was actually measured.…”

Section: Effect Of Co Nanoparticles On the Electrical Resistivity Of supporting

confidence: 92%

“…Therefore, according to the Linde-Norbury rule, minor additions of Co should have a comparatively insignificant effect on the electrical resistivity of Sn. It should be noted that Co practically does not dissolve in pure Sn [28] while Co atoms substitute Cu in the Cu 6 Sn 5 compound and vice versa Cu atoms substitute Co in the CoSn 3 compound [26]. Furthermore, the presented electrical resistivity values for (SAC387) 100x (nanoCo) x solder ribbons are in agreement with results from Ref.…”

Section: Effect Of Co Nanoparticles On the Electrical Resistivity Of supporting

confidence: 89%

“…Furthermore, the refinement of the microstructure could also be due to the formation of new (Co,Cu)Sn 3 IMC grains, the formation of which was also reported for (SAC305) 100−x Co x (x = 0-0.8 wt%) alloys in Ref. [26].…”

Section: Effects Of Co Nanoparticles On Mechanical Properties Of Sac3supporting

confidence: 64%

“…That these suggestions are in agreement with results of Refs. [26,34] indicating a catalytic action of Co for the nucleation of solidification in SAC solders.…”

Section: Morphology and Growth Of Interfacial Imcs Layer At The Intermentioning

confidence: 99%

See 3 more Smart Citations

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Yakymovych

Plevachuk

Švec

et al. 2017

J Mater Sci: Mater Electron

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Section: Effect Of Co Nanoparticles On the Electrical Resistivity Of supporting

confidence: 92%

Section: Effect Of Co Nanoparticles On the Electrical Resistivity Of supporting

confidence: 89%

Section: Effects Of Co Nanoparticles On Mechanical Properties Of Sac3supporting

confidence: 64%

“…That these suggestions are in agreement with results of Refs. [26,34] indicating a catalytic action of Co for the nucleation of solidification in SAC solders.…”

Section: Morphology and Growth Of Interfacial Imcs Layer At The Intermentioning

confidence: 99%

See 2 more Smart Citations

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Yakymovych

Plevachuk

Švec

et al. 2017

J Mater Sci: Mater Electron

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“…[15][16][17][18][19] It was shown that minor metal nanoadditions have an impact on the microstructure of solidified SAC solders, but practically without any significant change of the melting temperatures. [15][16][17] Calorimetric measurements revealed that additions of Co in bulk and nanosized form to a liquid Sn-3.8Ag-0.7Cu alloy resulted in additional heat effects during melting of the Co nanoparticles compared to those in bulk form. [19] During the soldering process the solid joint is heated up to approx.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Yakymovych

Plevachuk

Sklyarchuk

et al. 2017

J. Phase Equilib. Diffus.

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The electrical conductivity of nanocomposite Sn-3.0Ag-0.5Cu alloys with two different weight percentages of Ni nanoparticles (1.0 and 2.0 wt.%) was measured over a wide temperature range. The samples were produced using a cold pressing method: Sn-3.0Ag-0.5Cu powder and Ni nanopowder were mechanically mixed and pressed into 8 mm diameter rods. Ni nanoparticles were synthesized via a chemical reduction method and characterized by a core/ shell structure. Temperature dependencies of the electrical conductivity revealed a hysteresis between the heating and cooling curves in a wide temperature range above the melting temperature. This fact is connected with structure transformations accompanied by a dissolution of Ni nanoparticles, which should be retarded due to an oxide/ hydroxide shell on the surface of the nanoparticles. A microstructure analysis of the samples in the solid state showed a fine distribution of intermetallic compounds in the Sn-based matrix. The Ni atoms substituted for Cu atoms in the Cu 6 Sn 5 compound forming a (Cu,Ni) 6 Sn 5 phase.

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Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

Qiu

Han

Zhang

et al. 2021

J Mater Sci: Mater Electron

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Effect of nano Co reinforcements on the structure of the Sn-3.0Ag-0.5Cu solder in liquid and after reflow solid states

Cited by 17 publications

References 27 publications

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

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