2005
DOI: 10.1016/j.chemgeo.2005.04.009
|View full text |Cite
|
Sign up to set email alerts
|

Thermodynamic properties of copper chloride complexes and copper transport in magmatic-hydrothermal solutions

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

8
72
1
2

Year Published

2007
2007
2022
2022

Publication Types

Select...
9
1

Relationship

1
9

Authors

Journals

citations
Cited by 122 publications
(83 citation statements)
references
References 64 publications
8
72
1
2
Order By: Relevance
“…Figure 11 compares the logK Θ of Cu-Cl and Cu-HS complexes based on different experimental studies (Akinfiev and Zotov, 2001;Brugger et al, 2007;Liu W and McPhail, 2005;Liu W et al, 2001;Mountain and Seward, 1999;Xiao et al, 1998) as a function of temperature, with the predicted logK Θ by MD simulations. Discrepancies of around one logK unit among different experimental studies are common, and indeed thermodynamic integration shows good potential to predict thermodynamic properties under wide range of conditions.…”
Section: Ab Initio MD Simulation Of Cu(i) Complexationmentioning
confidence: 99%
“…Figure 11 compares the logK Θ of Cu-Cl and Cu-HS complexes based on different experimental studies (Akinfiev and Zotov, 2001;Brugger et al, 2007;Liu W and McPhail, 2005;Liu W et al, 2001;Mountain and Seward, 1999;Xiao et al, 1998) as a function of temperature, with the predicted logK Θ by MD simulations. Discrepancies of around one logK unit among different experimental studies are common, and indeed thermodynamic integration shows good potential to predict thermodynamic properties under wide range of conditions.…”
Section: Ab Initio MD Simulation Of Cu(i) Complexationmentioning
confidence: 99%
“…50-200 ppm, is generally used for copper electroplating 17 and 1 to 2610 23 mol dm 23 used in the electronics and electrical industries. 18 A higher chloride ion concentration (0?1-3?0 mol dm 23 ) is used in copper electrowinning; levels up to 9?0 mol dm 23 are used for copper refining in hydrothermal systems 19 and 280 g dm 23 used in the leaching of copper from copper mineral chalcopyrite. 20 In most cases, chloride ion is added as a supplement to other additives to achieve combinatorial effects.…”
Section: Introductionmentioning
confidence: 99%
“…The preferential remobilisation of Pt over Pd by postmagmatic hydrothermal fluids can be tentatively explained in terms of the factors affecting the solubility of these metals in the aqueous fluid. In magmatic-hydrothermal environments, between 500 and 300 QC, copper is preferentially dissolved in hypersaline, neutral-weak acidic, and intermediate reduced solutions and mainly transported as CuCl2 - (Liu and McPhail, 2005 and references therein). Major factors controlling chalcopyrite deposition are decrease of temperature, and salinity (i.e., Cl availability), and to a lesser extend, decrease of alogical evidences indicate that cha1copyrite was remobilised by hydrothermal fluids and precipitated again at around 350 QC, these factors would have competed among them in the solubility reactions of copper and therefore, dissolution of cha1copyrite was limited.…”
Section: Role Of Hydrothermal Fl Uidsmentioning
confidence: 99%