Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

Abstract

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Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

“…2. It has been proven that the coupling effects of RE and nanoparticles can further refine the microstructure and improve the mechanical properties of lead-free solders [97]. Thus, the combined addition of RE and nanoparticles may become a new reinforcement method to improve the performance of the solders.…”

“…Due to small tendency of agglomeration and fine physical and chemical properties, carbon-based nanomaterials can effectively improve the microstructure of lead-free solders and improve the properties [97,98]. Consequently, the development of new carbon-based nanomaterial-reinforced solders with better performance may become a new direction for the future research.…”

Selective etching and hardness properties of quenched SAC305 solder joints

“…The fine Cu 6 Sn 5 and Ag 3 Sn phases in the b -Sn matrix can improve the mechanical properties of the SAC305 solder joints (Garami and Krammer, 2015). However, there are several factors such as phase migration (Chen et al, 2016), thermal aging (Deng et al, 2005;Wang and Nishikawa, 2014), type of substrate (Liu et al, 2015) and solidification rate that can facilitate the formation of larger IMC phases. The larger IMC phases impede lower dislocation movement.…”

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

“…Consequently, trace amount of alloying elements (Ni [8][9][10], Mn [11], Bi [12], Co [13,14], Cr [15], Al [9], Sb [10], Fe [16], and rare earth (RE) [17,18]) is incorporated with Sn-based lead-free solder to enhance the comprehensive properties. Moreover, with the popularity and utilization of nanometer materials fabricating technology, the nanometer particles are doped with Sn-based lead-free solder to improve the comprehensive properties, such as nanometer oxide (Al 2 O 3 [19][20][21], BaTiO 3 [22], Y 2 O 3 [23], TiO 2 [24][25][26][27], and ZrO 2 [28,29]), nanometer carbide ( [30,31]), nanometer IMC (Cu 6 Sn 5 [32][33][34]), and carbon-based nanometer materials (carbon nanotubes (CNTs) [35][36][37], graphene [38][39][40], and fullerenes [41][42][43]). Generally speaking, the addition of nanoparticles acts as reinforcing phase in the Sn-based lead-free composite solder alloys.…”