2013
DOI: 10.1109/tcpmt.2013.2239702
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Thermo-Mechanical Characterization of Au-In Transient Liquid Phase Bonding Die-Attach

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Cited by 28 publications
(9 citation statements)
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“…Transient Liquid Phase Bonding (TLPB) realized by bonding of parent materials with pre-deposited low-melting metal layer, whereas Transient Liquid Phase Soldering (TLPS) involves usage of the printed standard soft solders as interlayer for intermetallic phase (IMP) formation [77], [86]- [89]. The diffusion solder have Ag/In [90], [91], Ag/Sn [92], Au/In [93], [94], Au/ Sn [95], [96], Cu/Sn [97], [98], and Ni/Sn [99]. Considered the cost and environment friendly, the Cu-Sn alloy solder has been a good candidate for high temperature applications.…”
Section: Au100mentioning
confidence: 99%
“…Transient Liquid Phase Bonding (TLPB) realized by bonding of parent materials with pre-deposited low-melting metal layer, whereas Transient Liquid Phase Soldering (TLPS) involves usage of the printed standard soft solders as interlayer for intermetallic phase (IMP) formation [77], [86]- [89]. The diffusion solder have Ag/In [90], [91], Ag/Sn [92], Au/In [93], [94], Au/ Sn [95], [96], Cu/Sn [97], [98], and Ni/Sn [99]. Considered the cost and environment friendly, the Cu-Sn alloy solder has been a good candidate for high temperature applications.…”
Section: Au100mentioning
confidence: 99%
“…This approach has been demonstrated for the packaging of high-temperature, wide-bandgap devices [129,140,141,142], image sensors [143], and in-chip stacking applications [144,145,146]. More recently, the Au-In approach has also been demonstrated for WLVP using passive substrates [147,148].…”
Section: Bonding Approachesmentioning
confidence: 99%
“…Ag, Au, Cu, Co or Ni), (3) intermetallic compounds (IMCs) formation that leads to isothermal solidification and (4) homogenization of the interconnection structure. Au-Sn and Cu-Sn based metallurgies are the most commonly utilized material options for SLID out of the several different demonstrated binary systems; Ag-In, [6][7][8] Au-In, 3,[9][10][11][12][13][14] Cu-In, 15 Ag-Sn, 16,17 Ni-Sn, 3,[18][19][20] Au-Sn [21][22][23][24][25][26][27][28] and Cu-Sn. 5,[29][30][31][32][33][34][35][36][37][38] Au-Sn and Cu-Sn systems have been demonstrated to form mechanically and chemically reliable bonds at bonding temperatures close to 300°C.…”
Section: Introductionmentioning
confidence: 99%