Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

Yoon, Jeong‐Won; Lee, Jong-Gun; Lee, Jong-Bum; Noh, Bo‐In; Jung, Seung‐Boo

doi:10.1007/s10854-011-0402-1

Cited by 8 publications

(5 citation statements)

References 11 publications

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“…ENIG and ENEPIG surface finishes have been the successfully applied methods for the bonding strength enhancement of solder joints for Sn-based solders in the electronic industries. 4,6,10,27,28 To understand these discrepancies of surface finishes due to epoxy addition, the fracture surfaces of both the board side and the solder side of the samples after the drop test were investigated. Figures 6 and 7 show the morphologies and chemical compositions of SBE-ENIG and SBE-ENEPIG, respectively.…”

Section: Resultsmentioning

confidence: 99%

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Myung

Kim

Jung

2015

Journal of Elec Materi

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The effect of different surface finishes, electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (EN-EPIG), on the mechanical properties of Sn-58Bi bumps made with solder paste enhanced with epoxy were investigated. The microstructure and fracture surfaces were observed with scanning electron microscopy, and the compositions of the IMC and solder were measured using energy dispersive spectrometry and an electron probe micro-analyzer (EPMA). To evaluate the mechanical properties, low-speed shear tests and board-level drop tests were performed. The result of the shear tests showed that the bonding strength of the epoxy-enhanced Sn-58Bi solder bumps was higher than that of Sn-58Bi solder for all surface finishes, because of the epoxy surrounding the solder, and the fracture surfaces of epoxy-enhanced Sn-58Bi indicated ductile fracture in the solder joint. However, the result of the drop tests showed that samples with the ENIG and ENEPIG surface finishes had lower drop numbers compared to the sample without these surface finishes. The lower performance resulted from insufficient ejection of epoxy from the ENIG and ENEPIG surface finishes during reflow, which reduced the interfacial bonding area.

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Section: Resultsmentioning

confidence: 99%

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Myung

Kim

Jung

2015

Journal of Elec Materi

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“…This fume remaining inside of FPCB causes the defect in fine pitch pattern generation and degradation of quality. Release film sheet, which is consited with several films according to FPCB layer, is used for elemination of fume and absorption of shock in the lay-up process [2,3,4].…”

Section: Fig 1 Configuration Of Flexible Printed Circuit Boardmentioning

confidence: 99%

Development of Release Film Automatic Adhesion Machine for Production of Flexible Printed Circuit Board

Chung

Hyuk

2013

AMM

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Industrial areas using FPCB are broadening from simple conection for bending of rigid PCB to main component of elecronic equipment. Fume is generated by melting of adhesion material during the hot press process for manufacturing of FPCB. Release film sheet is used for elemination of gas and absorption of shock in the hot press process. In this paper, release film automatic adhesion machine for hot press process is developed, and ultrasonic welding condition is proposed for optimization of adhesion strength between release films. The performance test of developed machine is conducted.

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“…So far, several electronic devices have adopted the coupling between RPCB and FPCB. For example, Yoon et al [23] applied the thermo-compression bonding method to bind these two boards. The authors had successfully determined the optimum bonding conditions, i.e., force, time, and temperature.…”

Section: Introductionmentioning

confidence: 99%

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process

Ahmad

Aziz

Abdullah

et al. 2021

Metals

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This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.

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Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

Cited by 8 publications

References 11 publications

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Development of Release Film Automatic Adhesion Machine for Production of Flexible Printed Circuit Board

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process

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